المؤلفون: van der Veen, Marleen H., Soethoudt, J., Delabie, A., Pedreira, O. Varela, Vega Gonzalez, V., Lariviere, S., Teugels, L., Jourdan, N., Decoster, S., Struyf, H., Wilson, C. J., Croes, K., Tokei, Zs.

المصدر: 2020 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC),2020 IEEE International. :16-18 Oct, 2020

Relation: 2020 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Wilson, C. J. N., Scott, B. J. (Bradley J.), 1954-, Houghton, B. F.

المصدر: Tephra, Sep 2004; v.21:p.2-11

URL الوصول: https://www.civildefence.govt.nz/assets/Archive/tephra-september-2004.pdf

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المؤلفون: Clark, W. F., Juncker, A., Paladugu, E., Fried, D., Wilson, C. J., Pourtois, G., Gallagher, M., De Jamblinne, A., Piumi, D., Boemmels, J., Tokei, Z. S., Mocuta, D.

المصدر: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2016 International Conference on. :43-46 Sep, 2016

Relation: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: van der Veen, Marleen H., Heyler, N., Pedreira, O. Varela, Ciofi, I., Decoster, S., Gonzalez, V. Vega, Jourdan, N., Struyf, H., Croes, K., Wilson, C. J., Tokei, Zs.

المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :172-174 Jun, 2018

Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Wilson, C. J. N., Houghton, B. F., Scott, B. J. (Bradley J.), 1954-

المصدر: Tephra, Oct 1995; v.14 n.2:p.2-11,33

المؤلفون: Scott, B. J. (Bradley J.), 1954-, Houghton, B. F., Wilson, C. J. N.

المصدر: Tephra, Oct 1995; v.14 n.2:p.12-17,33

المؤلفون: Guissi, S., Clark, W. F., Juncker, A., Ervin, J., Greiner, K., Fried, D., Briggs, B., Devriendt, K., Sebaai, F., Charley, A., Wilson, C. J., Boemmels, J., Tokei, Z.

المصدر: 2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017

Relation: 2017 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Briggs, B., Wilson, C. J., Devriendt, K., van der Veen, M. H., Decoster, S., Paolillo, S., Versluijs, J., Kesters, E., Sebaai, F., Jourdan, N., El-Mekki, Z., Heylen, N., Verdonck, P., Wan, Danny, Pedreira, O. Varela, Croes, K., Dutta, S., Ryckaert, J., Mallik, A., Lariviere, S., Bommels, J., Tokei, Zs.

المصدر: 2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017

Relation: 2017 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: Vega-Gonzalez, V., Wilson, C. J., Briggs, B., Decoster, S., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :19.3.1-19.3.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)