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1دورية أكاديمية
المؤلفون: Kunz, C., Hlavac, M., Schneider, M., Pala, A., Henrich, P., Jickeli, B., Worn, H., Hein, B., Wirtz, R., Mathis-Ullrich, F.
المصدر: IEEE Transactions on Medical Robotics and Bionics IEEE Trans. Med. Robot. Bionics Medical Robotics and Bionics, IEEE Transactions on. 3(3):738-749 Aug, 2021
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2مؤتمر
المؤلفون: Presura, R., Bauer, B.S., Esaulov, A., Fuelling, S., Ivanov, V., Le Galloudec, N., Makhin, V., Siemon, R.E., Sotnikov, V.I., Wirtz, R., Astanovitsky, A., Batie, S., Faretto, H., Le Galloudec, B., Oxner, A., Angelova, M., Laca, P., Guzzetta, S., Keely, S., Rogowski, S., Oliver, B.V., Struve, K.W.
المصدر: Digest of Technical Papers. PPC-2003. 14th IEEE International Pulsed Power Conference (IEEE Cat. No.03CH37472) Pulsed power conference Pulsed Power Conference, 2003. Digest of Technical Papers. PPC-2003. 14th IEEE International. 2:859-862 Vol.2 2003
Relation: Digest of Technical Papers. PPC-2003. 14th IEEE International Pulsed Power Conference
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3مؤتمر
المؤلفون: Newbury, R., Wirtz, R., Cochrane, J., Kemp, N.T., Nicholls, J.T., Tribe, W.R., Simmons, M.Y., Pepper, M.
المصدر: 2002 Conference on Optoelectronic and Microelectronic Materials and Devices. COMMAD 2002. Proceedings (Cat. No.02EX601) Optoelectronic and microelectronic materials and device Optoelectronic and Microelectronic Materials and Devices, 2002 Conference on. :299-302 2002
Relation: 2002 Conference on Optoelectronic and Microelectron Materials and Devices
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4دورية أكاديمية
المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 32(1):53-62 Mar, 2009
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5مؤتمر
المؤلفون: Wang, E., Wirtz, R., Greiner, M.
المصدر: FIE '98. 28th Annual Frontiers in Education Conference. Moving from 'Teacher-Centered' to 'Learner-Centered' Education. Conference Proceedings (Cat. No.98CH36214) FIE '98: frontiers in education Frontiers in Education Conference, 1998. FIE '98. 28th Annual. 3:1313-1318 vol.3 1998
Relation: Proceedings of IEEE Computer Society Symposium Frontiers in Education
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6مؤتمر
المؤلفون: Laca, Paul, Wirtz, R. A.
المصدر: 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE. :9-16 Mar, 2009
Relation: 2009 IEEE/CPMT 25th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
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7مؤتمر
المؤلفون: Sloan, Alison, Penley, Sean, Wirtz, R. A.
المصدر: 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE. :246-253 Mar, 2009
Relation: 2009 IEEE/CPMT 25th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
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8دورية أكاديمية
المؤلفون: Hlaváč, M.Aff1, Sommer, F., Karpel-Massler, G., Wirtz, R., Hoffmann, T., Paľa, A.
المصدر: HNO: Deutsche Gesellschaft für Hals-Nasen-Ohren-Heilkunde, Kopf- und Hals-Chirurgie. 67(4):307-318
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9مؤتمر
المؤلفون: Wirtz, R., Tianwen Zhao, Yanyao Jiang
المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 1:549-556 Vol.1 2004
Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems
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10
المؤلفون: Klümper, N., Sikic, D., Saal, J., Büttner, T., Goldschmidt, F., Jarczyk, J., Becker, P., Zeuschner, P., Weinke, M., Kalogirou, C., Breyer, J., Burger, M., Nuhn, P., Tully, K., Roghmann, F., Bolenz, C., Zengerling, F., Wirtz, R., Muders, M., Kristiansen, G., Bald, T., Ellinger, J., Wullich, B., Hölzel, M., Hartmann, A., Erben, P., Ritter, M., Eckstein, M.
المصدر: 62. Jahrestagung der Südwestdeutschen Gesellschaft für Urologie e.V.; 20220622-20220625; Koblenz; DOCV4.8 /20220510/
مصطلحات موضوعية: ddc: 610, Medicine and health
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d5992ad6c0810f62d80f40b0f3a9513
http://nbn-resolving.de/urn:nbn:de:0183-22swdgu0371