المؤلفون: Barci, M., Leonelli, D., Zhou, X., Wang, X., Garbin, D., Jayakumar, G., Witters, T., Vergel, N.F., Kundu, S., Palayam, S.V., Jiao, H., Wu, H., Kar, G.S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(11):6106-6112 Nov, 2022

المؤلفون: Thesberg, M., Stanojevic, Z., Baumgartner, O., Kernstock, C., Leonelli, D., Barci, M., Wang, X., Zhou, X., Jiao, H., Donadio, G. L., Garbin, D., Witters, T., Kundu, S., Hody, H., Delhougne, R., Kar, G., Karner, M.

المصدر: Solid-State Electronics, Volume 199, January 2023, 108504

مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Materials Science, Physics - Applied Physics

URL الوصول: http://arxiv.org/abs/2211.06084

المؤلفون: Ravsher, T., Sharifi, S. H., Fantini, A., Hody, H., Witters, T., Garbin, D., Degraeve, R., Afanas'ev, V., van Houdt, J., Goux, L., Crotti, D., Kar, G.

المصدر: 2021 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2021 IEEE International. :1-4 May, 2021

Relation: 2021 IEEE International Memory Workshop (IMW)

المؤلفون: Vega-Gonzalez, V., Montero, D., Versluijs, J., Pedreira, O. Varela, Jourdan, N., Puliyalil, H., Chehab, B., Peissker, T., Haider, A., Batuk, D., Martinez, G. T., Geypen, J., Le, Q. T., Bazzazian, N., Heylen, N., van der Veen, M., El-Mekki, Z., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Gillijns, W., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Ciofi, I., De Wachter, B., Swerts, J., Grieten, E., Ercken, M., Kim, R., Croes, K., Leray, P., Jaysankar, M., Nagesh, N., Ramakers, L., Murdoch, G., Park, S., Tokei, Z., Dentoni-Litta, E., Horiguchi, N.

المصدر: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

المؤلفون: De Proft, A., Garbin, D., Donadio, G.L., Hody, H., Witters, T., Lodewijks, K., Rottenberg, X., Goux, L., Delhougne, R., Kar, G.S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(10):4228-4233 Oct, 2020

المؤلفون: Vega-Gonzalez, V., Puliyalil, H., Versluijs, J., Lesniewska, A., Varela-Pereira, O., Baert, R., Paolillo, S., Decoster, S., Schleicher, F., Montero, D., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Teugels, L., Heylen, N., Jourdan, N., El-Mekki, Z., van der Veen, M., Ciofi, I., Briggs, B., Heijlen, J., Dupas, L., De-Wachter, B., Vancoille, E., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Demonie, I., Lazzarino, F., Ercken, M, Kim, R., Trivkovic, D., Croes, K., Leray, P., Jaysankar, M., Wilson., C., Muroch, G., Tokei, Z.

المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :20.5.1-20.5.4 Dec, 2020

Relation: 2020 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Thesberg, M., Stanojevic, Z., Baumgartner, O., Kernstock, C., Leonelli, D., Barci, M., Wang, X., Zhou, X., Jiao, H., Donadio, G.L., Garbin, D., Witters, T., Kundu, S., Hody, H., Delhougne, R., Kar, G., Karner, M.

المصدر: In Solid State Electronics January 2023 199

المؤلفون: Belmonte, A., Radhakrishnan, J., Goux, L., Donadio, G.L., Kumbhare, P., Redolfi, A., Delhougne, R., Nyns, L., Devulder, W., Witters, T., Covello, A., Vereecke, G., Franquet, A., Spampinato, V., Kundu, S., Mao, M., Hody, H., Kar, G. S.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :35.8.1-35.8.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Vega-Gonzalez, V., Wilson, C. J., Briggs, B., Decoster, S., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z.

المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :19.3.1-19.3.4 Dec, 2019

Relation: 2019 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Avasarala, Naga Sruti, Donadio, G. L., Witters, T., Opsomer, K., Govoreanu, B., Fantini, A., Clima, S., Oh, H., Kundu, S., Devulder, W., van der Veen, M. H., Van Houdt, J., Heyns, M., Goux, L., Kar, G. S.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :209-210 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology