-
1دورية أكاديمية
المؤلفون: Barci, M., Leonelli, D., Zhou, X., Wang, X., Garbin, D., Jayakumar, G., Witters, T., Vergel, N.F., Kundu, S., Palayam, S.V., Jiao, H., Wu, H., Kar, G.S.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(11):6106-6112 Nov, 2022
-
2تقرير
المؤلفون: Thesberg, M., Stanojevic, Z., Baumgartner, O., Kernstock, C., Leonelli, D., Barci, M., Wang, X., Zhou, X., Jiao, H., Donadio, G. L., Garbin, D., Witters, T., Kundu, S., Hody, H., Delhougne, R., Kar, G., Karner, M.
المصدر: Solid-State Electronics, Volume 199, January 2023, 108504
مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Materials Science, Physics - Applied Physics
URL الوصول: http://arxiv.org/abs/2211.06084
-
3مؤتمرThreshold switching in a-Si and a-Ge based MSM selectors and its implications for device reliability
المؤلفون: Ravsher, T., Sharifi, S. H., Fantini, A., Hody, H., Witters, T., Garbin, D., Degraeve, R., Afanas'ev, V., van Houdt, J., Goux, L., Crotti, D., Kar, G.
المصدر: 2021 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2021 IEEE International. :1-4 May, 2021
Relation: 2021 IEEE International Memory Workshop (IMW)
-
4مؤتمر
المؤلفون: Vega-Gonzalez, V., Montero, D., Versluijs, J., Pedreira, O. Varela, Jourdan, N., Puliyalil, H., Chehab, B., Peissker, T., Haider, A., Batuk, D., Martinez, G. T., Geypen, J., Le, Q. T., Bazzazian, N., Heylen, N., van der Veen, M., El-Mekki, Z., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Gillijns, W., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Ciofi, I., De Wachter, B., Swerts, J., Grieten, E., Ercken, M., Kim, R., Croes, K., Leray, P., Jaysankar, M., Nagesh, N., Ramakers, L., Murdoch, G., Park, S., Tokei, Z., Dentoni-Litta, E., Horiguchi, N.
المصدر: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021
Relation: 2021 IEEE International Interconnect Technology Conference (IITC)
-
5دورية أكاديمية
المؤلفون: De Proft, A., Garbin, D., Donadio, G.L., Hody, H., Witters, T., Lodewijks, K., Rottenberg, X., Goux, L., Delhougne, R., Kar, G.S.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(10):4228-4233 Oct, 2020
-
6مؤتمر
المؤلفون: Vega-Gonzalez, V., Puliyalil, H., Versluijs, J., Lesniewska, A., Varela-Pereira, O., Baert, R., Paolillo, S., Decoster, S., Schleicher, F., Montero, D., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Teugels, L., Heylen, N., Jourdan, N., El-Mekki, Z., van der Veen, M., Ciofi, I., Briggs, B., Heijlen, J., Dupas, L., De-Wachter, B., Vancoille, E., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Demonie, I., Lazzarino, F., Ercken, M, Kim, R., Trivkovic, D., Croes, K., Leray, P., Jaysankar, M., Wilson., C., Muroch, G., Tokei, Z.
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :20.5.1-20.5.4 Dec, 2020
Relation: 2020 IEEE International Electron Devices Meeting (IEDM)
-
7دورية أكاديمية
المؤلفون: Thesberg, M., Stanojevic, Z., Baumgartner, O., Kernstock, C., Leonelli, D., Barci, M., Wang, X., Zhou, X., Jiao, H., Donadio, G.L., Garbin, D., Witters, T., Kundu, S., Hody, H., Delhougne, R., Kar, G., Karner, M.
المصدر: In Solid State Electronics January 2023 199
-
8مؤتمر
المؤلفون: Belmonte, A., Radhakrishnan, J., Goux, L., Donadio, G.L., Kumbhare, P., Redolfi, A., Delhougne, R., Nyns, L., Devulder, W., Witters, T., Covello, A., Vereecke, G., Franquet, A., Spampinato, V., Kundu, S., Mao, M., Hody, H., Kar, G. S.
المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :35.8.1-35.8.4 Dec, 2019
Relation: 2019 IEEE International Electron Devices Meeting (IEDM)
-
9مؤتمر
المؤلفون: Vega-Gonzalez, V., Wilson, C. J., Briggs, B., Decoster, S., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z.
المصدر: 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :19.3.1-19.3.4 Dec, 2019
Relation: 2019 IEEE International Electron Devices Meeting (IEDM)
-
10مؤتمر
المؤلفون: Avasarala, Naga Sruti, Donadio, G. L., Witters, T., Opsomer, K., Govoreanu, B., Fantini, A., Clima, S., Oh, H., Kundu, S., Devulder, W., van der Veen, M. H., Van Houdt, J., Heyns, M., Goux, L., Kar, G. S.
المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :209-210 Jun, 2018
Relation: 2018 IEEE Symposium on VLSI Technology