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1دورية أكاديمية
المؤلفون: Wolff Andrzej, Kukulski Jacek
المصدر: Open Engineering, Vol 13, Iss 1, Pp 26-36 (2023)
مصطلحات موضوعية: dynamometer stand, heat transfer in brakes, computer simulation, Engineering (General). Civil engineering (General), TA1-2040
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2391-5439
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2
المؤلفون: WOLFF, MAX
Peer Reviewed: N
Page Count: 23
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3مؤتمر
المؤلفون: Xhoxhi, Edmir, Wolff, Vincent Albert
المصدر: 2024 IEEE Vehicular Networking Conference (VNC) Vehicular Networking Conference (VNC), 2024 IEEE. :329-335 May, 2024
Relation: 2024 IEEE Vehicular Networking Conference (VNC)
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4مؤتمر
المصدر: 2024 IEEE Vehicular Networking Conference (VNC) Vehicular Networking Conference (VNC), 2024 IEEE. :351-356 May, 2024
Relation: 2024 IEEE Vehicular Networking Conference (VNC)
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5مؤتمر
المؤلفون: Qureshi, Majad, Knutas, Antti, Wolff, Annika
المصدر: 2024 47th MIPRO ICT and Electronics Convention (MIPRO) MIPRO ICT and Electronics Convention (MIPRO), 2024 47th. :1877-1882 May, 2024
Relation: 2024 47th MIPRO ICT and Electronics Convention (MIPRO)
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6مؤتمر
المؤلفون: Chandrasekar, V., Kim, EunYeol, Biswas, Sounak Kumar, Wolff, David B., McLinden, Matthew, Junyent, Francesc, George, Jim
المصدر: 2024 IEEE Radar Conference (RadarConf24) Radar Conference (RadarConf24), 2024 IEEE. :1-6 May, 2024
Relation: 2024 IEEE Radar Conference (RadarConf24)
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7دورية أكاديمية
المؤلفون: Paul, S., Wolff, N., Kuremyr, T., Delepaut, C., Valenta, V., Heinrich, W., Bengtsson, O.
المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 72(7):4068-4079 Jul, 2024
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8دورية أكاديمية
المؤلفون: Wolff, M.W., Nanzer, J.A.
المصدر: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 23(5):1478-1482 May, 2024
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9مؤتمر
المؤلفون: Whitten, Paul, Wolff, Francis, Papachristou, Chris
المصدر: 2024 IEEE 3rd International Conference on Computing and Machine Intelligence (ICMI) Computing and Machine Intelligence (ICMI), 2024 IEEE 3rd International Conference on. :1-6 Apr, 2024
Relation: 2024 IEEE 3rd International Conference on Computing and Machine Intelligence (ICMI)
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10مؤتمر
المؤلفون: Trumann, Eike, Thieu, Gia Bao, Schmechel, Johannes, Weide-Zaage, Kirsten, Wolff, Dorian von, Bausen, Andre, Muller, Alexander, Paya-Vaya, Guillermo
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)