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المؤلفون: Peter Fruehauf, Andreas Weigert, Sven Rzepka, Rainer Dudek, Kerstin Kreyssig, Wolfgang Gruebl, Michael Novak
المصدر: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
مصطلحات موضوعية: Acceleration, Materials science, Test board, business.industry, Soldering, Fatigue testing, Numerical modeling, Structural engineering, business, Reliability (statistics), Finite element method, Term (time)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::eb205e911b410275f2b17571234e263c
https://doi.org/10.1109/itherm.2019.8757318