المؤلفون: Wu, Linda Y.L., Leng, B., He, W., Bisht, A., Wong, C.C.

المصدر: 2013 IEEE 5th International Nanoelectronics Conference (INEC) Nanoelectronics Conference (INEC), 2013 IEEE 5th International. :393-396 Jan, 2013

Relation: 2013 IEEE International Nanoelectronics Conference (INEC)

المؤلفون: Wong, C.C., Vaithilingam, S., Nair, M.

المصدر: 2011 IEEE International Symposium on Technology and Society (ISTAS) Technology and Society (ISTAS), 2011 IEEE International Symposium on. :1-5 May, 2011

Relation: 2011 IEEE International Symposium on Technology and Society (ISTAS)

المؤلفون: Ang, X.F., Liu, H.P, Tan, Y. L., Lu, H.J., Wei, J., Zhang, H.J., Chen, Z., Wong, C.C.

المصدر: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :251-254 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

المؤلفون: Wong, C.C., Hiew, P.L.

المصدر: Proceedings of ICSSSM '05. 2005 International Conference on Services Systems and Services Management, 2005. Services systems and services management Services Systems and Services Management, 2005. Proceedings of ICSSSM '05. 2005 International Conference on. 2:1355-1359 Vol. 2 2005

Relation: 2005 International Conference on Services Systems and Services Management

المؤلفون: Wong, C.C., Hiew, P.L.

المصدر: Proceedings of ICSSSM '05. 2005 International Conference on Services Systems and Services Management, 2005. Services systems and services management Services Systems and Services Management, 2005. Proceedings of ICSSSM '05. 2005 International Conference on. 2:1325-1330 Vol. 2 2005

Relation: 2005 International Conference on Services Systems and Services Management

المؤلفون: Wong, C.C., Hiew, P.L.

المصدر: International Conference on Mobile Business (ICMB'05) Mobile business Mobile Business, 2005. ICMB 2005. International Conference on. :187-192 2005

Relation: International Conference on Mobile Business

المؤلفون: Wong, C.C., Hiew, P.L.

المصدر: International Conference on Mobile Business (ICMB'05) Mobile business Mobile Business, 2005. ICMB 2005. International Conference on. :682-685 2005

Relation: International Conference on Mobile Business

المؤلفون: Pani, S.K., Wong, C.C., Premachandran, C.S., Iyer, M.K., Ramana, P.V., Lim, V., Ranganathan, N.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :381-384 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo, Wong, C.C., Ong, K., Chin Foo Goh

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :718-725 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Wong, C.C., Graham, S.

المصدر: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on. :1066-1074 2002

Relation: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems