يعرض 1 - 10 نتائج من 1,552 نتيجة بحث عن '"Wong, Ching-ping"', وقت الاستعلام: 0.97s تنقيح النتائج
  1. 1
    مؤتمر
    UV laser processing of super-hydrophilic graphene films with good electrical conductivity for high-voltage micro-capacitors

    المؤلفون: Liu, Huilong, Zheng, Yu, Gan, Litian, Chen, Yun, Chen, Xin, Wong, Ching-Ping

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-04 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  2. 2
    مؤتمر
    Superhydrophobic-Hydrophilic Interface Control of Laser-Processed Fluorine-Doped Graphene Films for Microfluidics

    المؤلفون: Liu, Huilong, Gan, Litian, Xie, Bin, Chen, Yun, Chen, Xin, Wong, Ching-Ping

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    مؤتمر
    On-package Additively Manufactured Chemiresistive Sensors for Smart Agriculture: Detection of Airborne Sex Pheromone of Domestic Silk Moths

    المؤلفون: Fang, Yunnan, Soto-Valle, Genaro, Fang, Andrew D., Lin, Zihao, Wong, Ching-Ping, Tentzeris, Manos M.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1733-1736 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    One-step Surface Modification for Boron Nitride and its Polymer Composite of Enhanced Thermal Conductivity for Advanced Packaging Applications

    المؤلفون: Lin, Zihao, Li, Jiaxiong, Sun, Zhijian, Fang, Andrew D., Moon, Kyoung-Sik, Wong, Ching-Ping

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2003-2007 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Large-scale production of boron nitride nanosheets-based epoxy nanocomposites with ultrahigh through-plane thermal conductivity for electronic encapsulation

    المؤلفون: Sun, Zhijian, Yu, Michael, Li, Jiaxiong, Moran, Macleary, Kathaperumal, Mohanalingam, Moon, Kyoung-Sik, Swaminathan, Madhavan, Wong, Ching-Ping

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1282-1286 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint

    المؤلفون: Li, Jiaxiong, Wilson, John, Cheung, Dylan, Sun, Zhijian, Moon, Kyoung-Sik, Swaminathan, Madhavan, Wong, Ching-Ping

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2018-2023 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  7. 7
    دورية أكاديمية
    Lightweight and drift-free magnetically actuated millirobots via asymmetric laser-induced graphene

    المؤلفون: Chen, Yun, Guo, Yuanhui, Xie, Bin, Jin, Fujun, Ma, Li, Zhang, Hao, Li, Yihao, Chen, XinAff1, IDs4146702448751x_cor8, Hou, Maoxiang, Gao, Jian, Liu, Huilong, Lu, Yu-JingAff2, IDs4146702448751x_cor12, Wong, Ching-Ping, Zhao, NiAff3, IDs4146702448751x_cor14

    المصدر: Nature Communications. 15(1)

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  8. 8
    دورية أكاديمية
    Biodegradable triboelectric nanogenerator as a implantable power source for embedded medicine devices

    المؤلفون: Jian, GangAff1, IDs41427023005282_cor1, Zhu, Shangtao, Yuan, Xiao, Fu, Shengqiao, Yang, Ning, Yan, Chao, Wang, XuAff2, IDs41427023005282_cor7, Wong, Ching-PingAff3, IDs41427023005282_cor8

    المصدر: NPG Asia Materials. 16(1)

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  9. 9
    مؤتمر
    The Effect of Thermal-Induced Warpage and Degeneration of Thermal Interface Materials on the Thermal Performance of a Flip-Chip Package

    المؤلفون: Jiang, Ruoyu, Zhonz, Cheng, Wang, Haozhe, Li, Chenglong, Zheng, Yi, Ren, Linlin, Lu, Jibao, Sun, Rong, Wong, Ching-Ping

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    Characterization and Verification of Viscoelastic Constitutive Parameters of Underfill Material

    المؤلفون: Zhong, Cheng, Li, Chenglong, Lu, Lu, Wang, Yunxia, Li, Gang, Zhu, Pengli, Lu, Jibao, Sun, Rong, Wong, Ching-Ping

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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