المؤلفون: Che, F.X., Pang, H.L.J., Wong, F.L., Lim, G.H., Low, T.H.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :107-113 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: To, C.H., Wong, F.L., Lee, C.S., Zapien, J.A.

المصدر: In Thin Solid Films 31 December 2013 549:22-29

المؤلفون: Wong, F.L., Fung, M.K., Ng, C.Y., Ng, A., Bello, I., Lee, S.T., Lee, C.S.

المصدر: In Thin Solid Films 2011 520(3):1131-1135

المؤلفون: Tsang, W.M., Wong, F.L., Fung, M.K., Chang, J.C., Lee, C.S., Lee, S.T.

المصدر: In Thin Solid Films 2008 517(2):891-895

المؤلفون: Wong, F.L., Chan, M.Y., Lai, S.L., Fung, M.K., Lai, K.H., Tsang, W.M., Ng, T.W., Poon, C.O, Lee, C.S., Lee, S.T.

المصدر: In Thin Solid Films 2008 516(22):8195-8198

المؤلفون: Xie, Z.Y., Li, Y.Q., Wong, F.L., Hung, L.S.

المصدر: In Materials Science & Engineering B 2004 106(3):219-223

المؤلفون: Wong, F.L

المساهمون: USGS

المصدر: Offshore Technology Conference.

الإتاحة: https://www.onepetro.org/conference-paper/OTC-5180-MS

المؤلفون: Huhman, M.E., Potter, L.D., Nolin, M.J., Piesse, A., Judkins, D.R., Banspach, S.W., Wong, F.L.

المصدر: American Public Health Association, American Journal of Public Health. 100(4):638-645

الإتاحة: https://ideas.repec.org/a/aph/ajpbhl/10.2105-ajph.2008.142968_9.html

المؤلفون: Steward, W.T., Charlebois, E.D., Johnson, M.O., Remien, R.H., Goldstein, R.B., Wong, F.L., Morin, S.F.

المصدر: American Public Health Association, American Journal of Public Health. 98(6):1011-1014

الإتاحة: https://ideas.repec.org/a/aph/ajpbhl/10.2105-ajph.2007.124933_7.html

المؤلفون: Wong, F.L., Fung, M.K., Jiang, X., Lee, C.S., Lee, S.T.

المساهمون: Publica

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______610::d78e94df18e5075be00fd07a8e4e8811
https://publica.fraunhofer.de/handle/publica/207562