يعرض 1 - 10 نتائج من 235 نتيجة بحث عن '"Wu Jixuan"', وقت الاستعلام: 0.88s تنقيح النتائج
  1. 1
    مؤتمر
    One-shot Read Processing to Enhance Cold Data Retention in Charge-trap TLC 3D NAND Flash

    المؤلفون: Yang, Shaoqi, Zhao, Xiaohuan, Xie, Kenie, Zhan, Xuepeng, Wu, Jixuan, Chen, Jiezhi

    المصدر: 2023 IEEE 15th International Conference on ASIC (ASICON) ASIC (ASICON), 2023 IEEE 15th International Conference on. :1-4 Oct, 2023

    Relation: 2023 IEEE 15th International Conference on ASIC (ASICON)

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  2. 2
    مؤتمر
    Flash-based Computing-in-memory Architectures with High-accuracy and Robust Reliabilities for General-purpose Applications

    المؤلفون: Feng, Yang, Qi, Yueran, Zhan, Xuepeng, Wu, Jixuan, Chen, Jiezhi

    المصدر: 2023 IEEE 15th International Conference on ASIC (ASICON) ASIC (ASICON), 2023 IEEE 15th International Conference on. :1-4 Oct, 2023

    Relation: 2023 IEEE 15th International Conference on ASIC (ASICON)

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  3. 3
    دورية أكاديمية
    Hydrophobin HGFI–based fibre-optic biosensor for detection of antigen–antibody interaction

    المؤلفون: Duan Shaoxiang, Wang Bo, Qiao Mingqiang, Zhang Xu, Liu Bo, Zhang Hao, Song Binbin, Wu Jixuan

    المصدر: Nanophotonics, Vol 9, Iss 1, Pp 177-186 (2019)

    مصطلحات موضوعية: s-tapered fibre, hydrophobin, fibre surface functionalisation, antigen–antibody interaction, Physics, QC1-999

    وصف الملف: electronic resource

    Relation: https://doaj.org/toc/2192-8606; https://doaj.org/toc/2192-8614

    URL الوصول: https://doaj.org/article/156fa2855ba44be19561aabb44e92348

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  4. 4
    مؤتمر
    Cross-Temperature Reliabilities in TLC 3D NAND Flash Memory: Characterization and Solution

    المؤلفون: Guo, Yifan, Xie, Kenie, Fang, Xiaotong, Zhan, Xuepeng, Wu, Jixuan, Chen, Jiezhi

    المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023

    Relation: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  5. 5
    مؤتمر
    Grain Size Reduction of Ferroelectric HZO Enabled by a Novel Solid Phase Epitaxy (SPE) Approach: Working Principle, Experimental Demonstration, and Theoretical Understanding

    المؤلفون: Zhang, Dong, Wu, Jixuan, Kong, Qiwen, Zhou, Zuopu, Liu, Long, Han, Kaizhen, Sun, Chen, Wang, Xiaolin, Liu, Gan, Jiao, Leming, Zheng, Zijie, Kang, Yuye, Chen, Jiezhi, Gong, Xiao

    المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023

    Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

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  6. 6
    مؤتمر
    Large Suppression to Lateral Charge Migration (LCM) Related Error Bits in Charge-Trap TLC 3D NAND Flash

    المؤلفون: Xie, Kenie, Guo, Pena, Chen, Fei, Chen, Binglu, Fang, Xiaotong, Wu, Jixuan, Zhan, Xuepeng, Chen, Jiezhi

    المصدر: 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) Integrated Circuits, Technologies and Applications (ICTA), 2022 IEEE International Conference on. :24-25 Oct, 2022

    Relation: 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

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  7. 7
    مؤتمر
    Work-in-Progress: High-Precision Short-Term Lifetime Prediction in TLC 3D NAND Flash Memory as Hot-data Storage

    المؤلفون: Fang, Xiaotong, Zhang, Meng, Guo, Yifan, Chen, Fei, Chen, Binglu, Zhan, Xuepeng, Wu, Jixuan, Wu, Fei, Chen, Jiezhi

    المصدر: 2022 International Conference on Compilers, Architecture, and Synthesis for Embedded Systems (CASES) CASES Compilers, Architecture, and Synthesis for Embedded Systems (CASES), 2022 International Conference on. :11-12 Oct, 2022

    Relation: 2022 International Conference on Compilers, Architecture, and Synthesis for Embedded Systems (CASES)

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  8. 8
    مؤتمر
    Temperature-dependent Defect Behaviors in Ferroelectric Hf0.5Zr0.5O2 Thin Film: Re-wakeup Phenomenon and Underlying Mechanisms

    المؤلفون: Li, Xiaopeng, Wu, Jixuan, Tai, Lu, Wei, Wei, Sang, Pengpeng, Feng, Yang, Chen, Bo, Zhao, Guoqing, Zhan, Xuepeng, Wang, Xiaolei, Kobayashi, Masaharu, Chen, Jiezhi

    المصدر: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :32.3.1-32.3.4 Dec, 2022

    Relation: 2022 IEEE International Electron Devices Meeting (IEDM)

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  9. 9
    مؤتمر
    Miniature Fiber-optic Modal Interferometer Based on Ultrasonic-Cutting Technique for Low-range Refractive Index Sensing

    المؤلفون: Wang, Qian, Wu, Jixuan, Song, Binbin, Bai, Hua, Liu, Bo, Duan, Shaoxiang

    المصدر: 2021 19th International Conference on Optical Communications and Networks (ICOCN) Optical Communications and Networks (ICOCN), 2021 19th International Conference on. :1-3 Aug, 2021

    Relation: 2021 19th International Conference on Optical Communications and Networks (ICOCN)

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  10. 10
    مؤتمر
    A Vertical Channel Ferroelectric/Anti-Ferroelectric FET with ALD InOx and Field-Induced Polar-Axis Alignment for 3D High-Density Memory

    المؤلفون: Li, Zhuo, Wu, Jixuan, Mei, Xiaoran, Huang, Xingyu, Saraya, Takuya, Hiramoto, Toshiro, Takahashi, Takanori, Uenuma, Mutsunori, Uraoka, Yukiharu, Kobayashi, Masaharu

    المصدر: 2022 IEEE Silicon Nanoelectronics Workshop (SNW) Silicon Nanoelectronics Workshop (SNW), 2022 IEEE. :1-2 Jun, 2022

    Relation: 2022 IEEE Silicon Nanoelectronics Workshop (SNW)

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