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1دورية أكاديمية
المؤلفون: Wang Yi, Chen Yong, Dai Qinglin, Zhang Haonan, Wu Yimin, Tian Naili, He Bolin
المصدر: Jixie chuandong, Vol 47, Pp 81-88 (2023)
مصطلحات موضوعية: Electric vehicle, Two-speed transmission, Housing, Transmission error, Modal participation factor, Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
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2دورية أكاديمية
المصدر: Applied Mathematics and Nonlinear Sciences, Vol 9, Iss 1 (2024)
مصطلحات موضوعية: college art design, pluralism, innovation, 91c99, Mathematics, QA1-939
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2444-8656
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3دورية أكاديمية
المؤلفون: LIU Rui, CHEN Yong, LI GuangXin, WU YiMin, WANG WenQing, ZHAO YuTing
المصدر: Jixie qiangdu, Pp 1050-1057 (2023)
مصطلحات موضوعية: Helical gear, Tooth surface pitting, Dynamic simulation, Fault diagnosis, Mechanical engineering and machinery, TJ1-1570, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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4دورية أكاديمية
المؤلفون: Jia Sen, Chen Yong, Zang Libin, Wu Yimin
المصدر: Jixie chuandong, Vol 42, Pp 23-26 (2018)
مصطلحات موضوعية: Coated gear, Friction wear, Heat flux density, Convective heat transfer coefficient, Steady temperature field, Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
Relation: http://www.jxcd.net.cn/thesisDetails#10.16578/j.issn.1004.2539.2018.04.005; https://doaj.org/toc/1004-2539
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5مؤتمر
المؤلفون: Lu, Wenhan, Wu, Yimin, Ye, Fan, Ren, Junyan
المصدر: 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2022 IEEE 65th International Midwest Symposium on. :1-4 Aug, 2022
Relation: 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS)
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6مؤتمر
المؤلفون: Liu, Lulu, Wu, Yimin, Yu, Xinwei, Ye, Fan, Ren, Junyan
المصدر: 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2022 IEEE 65th International Midwest Symposium on. :1-4 Aug, 2022
Relation: 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS)
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7مؤتمر
المؤلفون: Qin, Zishan, Wu, Yimin, Pei, Jiayan, Lu, Jinwei, Huang, Shizhao, Liu, Liqun
المصدر: 2022 IEEE 46th Annual Computers, Software, and Applications Conference (COMPSAC) COMPSAC Computers, Software, and Applications Conference (COMPSAC), 2022 IEEE 46th Annual. :321-326 Jun, 2022
Relation: 2022 IEEE 46th Annual Computers, Software, and Applications Conference (COMPSAC)
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8مؤتمر
المؤلفون: Wu, Yimin, Lu, Wenhan, Ye, Fan, Ren, Junyan
المصدر: 2022 11th International Conference on Communications, Circuits and Systems (ICCCAS) Communications, Circuits and Systems (ICCCAS), 2022 11th International Conference on. :136-139 May, 2022
Relation: 2022 11th International Conference on Communications, Circuits and Systems (ICCCAS)
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9مؤتمر
المؤلفون: Yang, Xiaosong, Zhang, Hai, Huang, Dekun, Wu, Yimin, Gu, Yifan, Bao, Junyi, Gong, Xue, Jiang, Lei, Wu, Jiaqi, Janbahan, Aliasghar Keyvani, Li, Jun, Zhao, Yiping, Li, Hua
المصدر: 2021 International Workshop on Advanced Patterning Solutions (IWAPS) Advanced Patterning Solutions (IWAPS), 2021 International Workshop on. :1-4 Dec, 2021
Relation: 2021 International Workshop on Advanced Patterning Solutions (IWAPS)
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10مؤتمر
المؤلفون: Yang, Xiaosong, Zhang, Hai, Wu, Yimin, Wu, Liang, Xu, Zhonghua, Zhou, Xingyu, Bao, Junyi, Gu, Yifan, Gong, Xue
المصدر: 2021 International Workshop on Advanced Patterning Solutions (IWAPS) Advanced Patterning Solutions (IWAPS), 2021 International Workshop on. :1-4 Dec, 2021
Relation: 2021 International Workshop on Advanced Patterning Solutions (IWAPS)