يعرض 1 - 10 نتائج من 259 نتيجة بحث عن '"XIE Xiaochen"', وقت الاستعلام: 1.11s تنقيح النتائج
  1. 1
    مؤتمر
    Robust Fault-tolerant Control of Periodic Piecewise Time-varying Systems Based on Matrix Polynomials

    المؤلفون: Huang, Jiantai, Xie, Xiaochen, Lam, James

    المصدر: 2023 China Automation Congress (CAC) Automation Congress (CAC), 2023 China. :7361-7366 Nov, 2023

    Relation: 2023 China Automation Congress (CAC)

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  2. 2
    مؤتمر
    Local Management Scheduling Strategy for Uncertainty of Distribution Station Area Based on Low Voltage Flexible DC Interconnection

    المؤلفون: Guan, Qingwei, Kong, Peng, Meng, Dexin, Li, Xiaozhi, Xie, Xiaochen, Li, Zhining, Zhu, Junpeng

    المصدر: 2023 IEEE/IAS Industrial and Commercial Power System Asia (I&CPS Asia) Industrial and Commercial Power System Asia (I&CPS Asia), 2023 IEEE/IAS. :385-389 Jul, 2023

    Relation: 2023 IEEE/IAS Industrial and Commercial Power System Asia (I&CPS Asia)

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  3. 3
    تقرير
    Semi-supervised Domain Adaptation on Graphs with Contrastive Learning and Minimax Entropy

    المؤلفون: Xiao, Jiaren, Dai, Quanyu, Shen, Xiao, Xie, Xiaochen, Dai, Jing, Lam, James, Kwok, Ka-Wai

    المصدر: Neurocomputing (2024)

    مصطلحات موضوعية: Computer Science - Machine Learning

    URL الوصول: http://arxiv.org/abs/2309.07402

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  4. 4
    مؤتمر
    Transient liquid phase bonding of Sn-Pb solder with added Ni particles

    المؤلفون: Wang, Jiaxing, Yao, Quanbin, Lin, Pengrong, Huang, Yingzhuo, Xie, Xiaochen, Zhang, Zhi

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Study on Mechanical Behavior and Long-term Storage Reliability of Micro Flip Chip Mixed Solder Joints

    المؤلفون: Xie, Shuang, Wen, Huidong, Wang, Yong, Lin, Pengrong, Xie, Xiaochen, Huang, Yingzhuo

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :469-472 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  6. 6
    دورية أكاديمية
    Study on the 12 in. wafer uniformity of high aspect ratio TSV filling by using rotation cathode

    المؤلفون: Zhang, Chi, Zeng, Guoxian, Lin, Pengrong, Guo, Hengtong, Xu, ShiMeng, Xie, XiaoChen, Wang, Fuliang

    المصدر: In Microelectronic Engineering 15 September 2024 292

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  7. 7
    دورية أكاديمية
    Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism

    المؤلفون: Wu, Xuefeng, Hou, Zhuangzhuang, Xie, Xiaochen, Lin, Pengrong, Huo, Yongjun, Wang, Yong, Zhao, Xiuchen

    المصدر: In Journal of Materials Research and Technology July-August 2024 31:3226-3237

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  8. 8
    دورية أكاديمية
    High-reliability Sn37Pb/Sn58Bi composite solder joints by solid-liquid low-temperature soldering

    المؤلفون: Ye, Zi-Ting, Zhao, Xiuchen, Xie, Xiaochen, Chang, Jiahui, Chen, Weiwei

    المصدر: In Materials Today Communications December 2024 41

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  9. 9
    دورية أكاديمية
    State estimation with unknown measurement losses: A detector-based approach

    المؤلفون: Lin, Hong, Cai, Chenxiao, Lu, Shan, Xie, Xiaochen, Shi, Peng

    المصدر: In Information Sciences June 2024 670

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  10. 10
    دورية أكاديمية
    Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging

    المؤلفون: Zhao, Shuang, Zheng, Bing, Zhang, Donglin, Xie, Xiaochen, Qu, Zhibo, Wang, Yong, Zhao, Xiuchen, Lee, Chin C., Huo, Yongjun

    المصدر: In Journal of Materials Research and Technology May-June 2024 30:4600-4611

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