المؤلفون: Xia, Da-quan, Yang, Dong-hua, Liu, Xin, Zhou, Yu-feng, Gan, Gui-sheng, Wu, Yi-ping

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1696-1701 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Gan, Guisheng, Xia, Da-quan, Liu, Xin, Liu, Cong, Cheng, Hanlin, Ming, Zhongzhen, Gao, Haoyang, Yang, Dong-hua, Wu, Yi-ping

المصدر: Soldering & Surface Mount Technology, 2019, Vol. 31, Issue 2, pp. 85-92.

URL الوصول: http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2018-0026

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المؤلفون: Gan, Gui Sheng, Xia, Da Quan, Liu, Xin, Liu, Cong, Cheng, Han Lin, Ming, Zhong Zhen, Gao, Hao Yang, Yang, Bin

المصدر: Diffusion and Defect Data Part B: Solid State Phenomena; January 2019, Vol. 285 Issue: 1 p127-132, 6p