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1مؤتمر
المؤلفون: Wei, Zhen-Tao, Jiang, Yi-Zhou, Wang, Ying-Sheng, Huang, Wei, Xiao, Zhi-Qiang, Zhang, Wei
المصدر: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT), 2022 IEEE 16th International Conference on. :1-3 Oct, 2022
Relation: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
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2مؤتمر
المؤلفون: Liu, Dong-Sheng, Wang, Peng, Jiang, Yi-Zhou, Huang, Wei, Xiao, Zhi-Qiang, Yang, Hong-Qiang, Zhang, Wei.
المصدر: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT), 2022 IEEE 16th International Conference on. :1-3 Oct, 2022
Relation: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
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3مؤتمر
المؤلفون: Wang, Peng, Jiang, Yi-Zhou, Liu, Dong-Sheng, Zhang, You, Li, Wen-Hong, Huang, Wei, Xiao, Zhi-Qiang, Qiu, Yi-Wu, Zhou, Xin-Jie, Yang, Hong-Qiang, Zhang, Wei
المصدر: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT), 2022 IEEE 16th International Conference on. :1-3 Oct, 2022
Relation: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
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4مؤتمر
المؤلفون: Li, Xiao-Xi, Chen, Jin-Xin, Huang, Wei, Ji, Zhigang, Feng, Zhi-Hong, Wu, Su-Zhen, Xiao, Zhi-Qiang, Lu, Hong-Liang
المصدر: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-4 Jul, 2020
Relation: 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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5دورية أكاديمية
المؤلفون: Ding, Wen-Juan, Liu, Yu, Xiao, Zhi-Qiang, Gao, Li, Li, Yu-Chen, Zhu, Lin, Li, Xiang, Li, Wei-Min, Chen, Shuang, Li, Ai-Dong
المصدر: In Progress in Natural Science: Materials International June 2024 34(3):598-605
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6دورية أكاديمية
المصدر: Cailiao Baohu, Vol 56, Iss 3, Pp 6-12 (2023)
مصطلحات موضوعية: composite powder particles, solid wire, hardfacing, abrasion resistance, microstructure, abrasion mechanism, Materials of engineering and construction. Mechanics of materials, TA401-492, Technology
وصف الملف: electronic resource
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7دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
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8دورية أكاديمية
المؤلفون: Jiang, Yi-Zhou, Mo, Wei-Ye, Wang, Wei, Ma, Hong-Ping, Yu, Guo-Dong, Ge, Qin, Zhang, Kai, Huang, Wei, Xiao, Zhi-Qiang
المصدر: In Micro and Nanostructures February 2023 174
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9دورية أكاديمية
المؤلفون: Lin, Shao-xiaAff1, Aff2, IDs116290217170z_cor1, Zhang, Zhuan-lingAff3, Aff4, Xiao, Zhi-qiang, Liu, Xiao-lanAff1, Aff2, Zhang, Qing-hai
المصدر: Journal of Mountain Science. 19(4):1107-1118
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10دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.