المؤلفون: Xie, Weikun, Ji, Weiwei, Chen, Yuxuan, Wang, Houjun

المصدر: 2023 6th International Conference on Electronics Technology (ICET) Electronics Technology (ICET), 2023 6th International Conference on. :1022-1026 May, 2023

Relation: 2023 6th International Conference on Electronics Technology (ICET)

المؤلفون: Xie, Weikun, Mei, Sitao, Wang, Houjun, Zhang, Huibin

المصدر: 2021 IEEE 3rd International Conference on Circuits and Systems (ICCS) Circuits and Systems (ICCS), 2021 IEEE 3rd International Conference on. :15-18 Oct, 2021

Relation: 2021 IEEE 3rd International Conference on Circuits and Systems (ICCS)

المؤلفون: Xie, Weikun, Lin, Xiaohui, Wang, Houjun, Zhang, Kaihong

المصدر: 2021 IEEE 3rd International Conference on Circuits and Systems (ICCS) Circuits and Systems (ICCS), 2021 IEEE 3rd International Conference on. :41-45 Oct, 2021

Relation: 2021 IEEE 3rd International Conference on Circuits and Systems (ICCS)

المؤلفون: Xie, Weikun, Nan, Ziyuan, Gao, Shi

المصدر: 2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI) Electronic Measurement & Instruments (ICEMI), 2021 IEEE 15th International Conference on. :383-390 Oct, 2021

Relation: 2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI)

المؤلفون: Liu, Xin, Yu, Yongjian, Xie, Weikun, Zhang, Kaihong, Zhu, Kai

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Xie, Weikun, Cao, Guangqiang, Ji, Weiwei

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Yan, Chenkan, Wang, Dun, Zhang, Kaihong, Zhang, Huibin, Yu, Yongjian, Xie, Weikun, Zhu, Kai, Wan, Yongkang

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Wang, Shinan, Ma, Yong, Zhang, Kaihong, Yu, Yongjian, Wan, Yongkang, Xie, Weikun

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-3 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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المؤلفون: Xie, Weikun, Qi, Wenjing, Lin, Xiaohui, Wang, Houjun

المصدر: Applied Sciences (2076-3417); Jul2023, Vol. 13 Issue 13, p7951, 12p

مصطلحات موضوعية: FIELD programmable gate arrays, TEST methods, INTEGRATED circuits