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1مؤتمر
المؤلفون: Yu, Wei, Pan, Ling, Aik Boo, Kelvin Tan, Xing Che, Fa, Ong, Yeow Chon, Wan Ng, Hong, Fan, Richard
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :678-682 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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2مؤتمر
المؤلفون: Panigrahy, Sunil Kumar, Xing Che, Fa, Ong, Yeow Chon, Nagavenkata Nune, Prasad, Ng, Hong Wan
المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :926-931 Dec, 2023
Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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3مؤتمر
المؤلفون: Pang, J.H.L., Fa-Xing Che
المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1011-1017 2006
Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems
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4مؤتمر
المؤلفون: Fa-Xing Che, Pang, J.H.L., Xu, L.H.
المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :1018-1023 2006
Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems
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5
المؤلفون: Xiao-Fei Li, Yong-Ling Ban, Qiang Sun, Yong-Xing Che, Jun Hu, Zaiping Nie
المصدر: IEEE Antennas and Wireless Propagation Letters. 22:888-892
مصطلحات موضوعية: Electrical and Electronic Engineering
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6
المؤلفون: Xiao-Fei Li, Yong-Ling Ban, Qiang Sun, Yong-Xing Che, Jun Hu, Zaiping Nie
المصدر: IEEE Transactions on Antennas and Propagation. 70:12364-12369
مصطلحات موضوعية: Electrical and Electronic Engineering
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7
المؤلفون: Xiaozhao Li, Huaiwei Yan, Xing Che
المصدر: International Journal of Geomechanics. 23
مصطلحات موضوعية: Soil Science
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8مؤتمر
المؤلفون: Fa-Xing Che, Pang, J.H.L., Lu-Hua Xu
المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 2:4 pp. 2005
Relation: Proceedings of 7th Electronics Packaging Technology Conference
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9مؤتمر
المؤلفون: Fa-Xing Che, Pang, H.L.J.
المصدر: 2005 7th Electronic Packaging Technology Conference Electronics Packaging Technology Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th. 2:5 pp. 2005
Relation: Proceedings of 7th Electronics Packaging Technology Conference
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10
المؤلفون: Koustav Sinha, Christopher Glancey, Wren Chen, Pluck Yang, Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng
المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::db1eb05402850d3f920032106a99eb15
https://doi.org/10.1109/eptc56328.2022.10013291