المؤلفون: Zhang, Xile, Zhou, Fugen, Liu, Bo, Tianyu Xiong, B.S., Bai, Xiangzhi, Wu, Qiuwen

المصدر: 2022 15th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI) Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), 2022 15th International Congress on. :1-6 Nov, 2022

Relation: 2022 15th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI)

المؤلفون: Hang Tang, B.S., Yi-Fan Xiao, B.S., Yu-Mei Wu, B.S., Yi-Lin Xiong, B.S., Shu-Guang Gao, M.D.

المصدر: Arthroscopy Techniques, Vol 13, Iss 3, Pp 102889- (2024)

مصطلحات موضوعية: Orthopedic surgery, RD701-811

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2212628723003493; https://doaj.org/toc/2212-6287

URL الوصول: https://doaj.org/article/4d27f920b51c430594fc9d6b3e55eddc

المؤلفون: Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.

المصدر: Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :622-629 2005

Relation: 2005 Proceedings. 55th Electronic Components and Technology Conference

المؤلفون: Ren, F., Nah, J.W., Suh, J.O., Tu, K.N., Xiong, B.S., Xu, L.H., Pang, J.H.L.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :66-69 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Luhua Xu, Pang, J.H.L., Xiong, B.S.

المصدر: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Electronics packaging technology Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th. :410-413 2004

Relation: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)

المؤلفون: Pang, J.H.L., Xiong, B.S., Che, F.X.

المصدر: 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the EuroSimE 2004 Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on. :449-453 2004

Relation: Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004

المؤلفون: Pang, J.H.L., Low, P.T.H., Xiong, B.S.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 2:131-136 Vol.2 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Pang, J.H.L., Xiong, B.S., Neo, C.C., Mang, X.R., Low, T.H.

المصدر: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :673-679 2003

Relation: 53rd Electronic Components and Technology Conference, 2003. Proceedings.

المؤلفون: Pang, J.H.L., Low, T.H., Xiong, B.S., Che, F.

المصدر: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :470-478 2003

Relation: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)

المؤلفون: Pang, J.H.L., Xiong, B.S.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 28(4):830-840 Dec, 2005