المؤلفون: Xiaoping Wang, Zhiwen Chen, Wan Cao, Guoliang Xu, Li Liu, Sheng Liu, Honglang Li, Xunqing Shi, Qinglin Song, Zhiyi Xiao, Chao Sun

المصدر: IEEE Access, Vol 8, Pp 213799-213805 (2020)

مصطلحات موضوعية: Artificial neural network, tire pressure, indirect tire pressure monitoring system, under-inflated tire, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9262841/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/ea16400da95c4f518418c99a4e38b30b

المؤلفون: Bin Xie, Xunqing Shi, Han Ding, Kai Qiao

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :848-854 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Yaofeng Sun, Pang, J.H.L., Xunqing Shi, Tew, J.W.R.

المصدر: Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. Thermal and Thermomechanical Phenomena in Electronics Systems Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. :921-927 2006

Relation: 2006 Proceedings. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems

المؤلفون: Xunqing Shi, Pang, H.L.J., Zhang, X.R., Liu, Q.J., Ying, M.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 27(4):659-667 Dec, 2004

المؤلفون: Pang, H.L.J., Xueren Zhang, Xunqing Shi, Wang, Z.P.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 25(2):187-191 Jun, 2002

المؤلفون: Pang, J.H.L., Kwang Hong Tan, Xunqing Shi, Wang, Z.P.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 24(1):10-15 Mar, 2001

المؤلفون: Bin Xie, Xunqing Shi, Han Ding, Kai Qiao

المصدر: 56th Electronic Components and Technology Conference 2006 Electronic Components & Technology Electronic Components and Technology Conference, 2006. Proceedings. 56th. :8 pp. 2006

Relation: 2006 Proceedings. 56th Electronic Components & Technology Conference

المؤلفون: Zhiwen Chen, Xiaoping Wang, Chao Sun, Li Liu, Cao Wan, Zhiyi Xiao, Xunqing Shi, Honglang Li, Qinglin Song, Guoliang Xu, Sheng Liu

المصدر: IEEE Access, Vol 8, Pp 213799-213805 (2020)

مصطلحات موضوعية: Artificial neural network, General Computer Science, ComputingMilieux_THECOMPUTINGPROFESSION, Computer science, General Engineering, Tire pressure, indirect tire pressure monitoring system, Automotive engineering, CAN bus, Anti-lock braking system, tire pressure, under-inflated tire, Tire-pressure monitoring system, General Materials Science, Point (geometry), lcsh:Electrical engineering. Electronics. Nuclear engineering, lcsh:TK1-9971

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c7e55ba84f57b0640601d8ca3f4cfbab
https://ieeexplore.ieee.org/document/9262841/

المؤلفون: Xunqing, Shi, Pang, John HL, Qianjin, Yang, Zhiping, Wang, Jingxu, Nie

المصدر: Acta Mechanica Sinica. August 2002 18(4):356-367

المؤلفون: Xunqing, Shi, Zhiping, Wang, Pang, John HL, Xueren, Zhang, Jingxu, Nie

المصدر: Acta Mechanica Sinica. June 2002 18(3):274-287