نتائج البحث - "Y. Ohoka"

1

المؤلفون: L. M. Butler, O. Pabst, J. Huehn, B. Wahl, K. Aalto, T. Amagai, K. Kunizawa, H. Kagechika, A. Blaschitz, D. M. Otte, W. Maier, T. Glant, M. H. Jang, T. Kobezda, T. Higuchi, N. Hayasaka, S. I. Hammerschmidt, N. Higashi, A. Angyal, J. Alferink, A. Yokota, U. Syrbe, O. Yoshie, P. Knolle, Y. Fu, L. Nikitina, M. Itoi, E. Fusaoka-Nishioka, E. Umemoto, G. E. Rainger, K. Mori, M. Nishimura, E. Kivi, C. Egelston, B. Schürmann, B. Szilagyi, M. Schimek, B. Nuernberg, S. Jin, M. Hashizume, Y. Nishimura, Y. Ohoka, K. Poppensieker, S. N. Syed, E. Kremmer, T. Kinashi, M. Koyama, J. Keuschnigg, K. Shimano, Noah J. Tubo, M. Mihara, S. Song, S. Jalkanen, H. Yagi, H. C. Jeffery, M. Zhu, M. Nakajima, L. Birnbaumer, M. Maksimow, H. Takeuchi, D. D. Le, P. Dresing, R. Kannagi, N. Sato, A. Waisman, M. Prinz, T. Henttinen, G. B. Nash, T. Salminen, T. Sugita, M. Masutani, James Campbell, M. F. Schroeter, T. Tanaka, K. Hieshima, Y. Nymalm, J. Hecht, T. Imai, K. Elima, M. Salmi, A. Mildner, Y. Higuchi, M. Ahrendt, Y. Wang, I. Förster, A. Zimmer, R. Yamaoka, T. Kubo, S. Scheu, C. Kato, A. Limmer, Y. Maeda, H. M. McGettrick, M. Iwata, A. Menning, C. D. Buckley, R. P. Piekorz, K. Chiba, J. E. Gessner, U. Bode, H. Ahammer, K. Tateishi, A. Filer, K. Mikecz, B. A. Ratsch, R. Förster, S. Ichimiya, A. K. Shirakawa, A. Fukunari, M. Pink, L. Klotz, M. Miyasaka, S. R. Ali, K. Sugahara, T. Katakai, R. E. Schmidt, G. Dohr, T. Nakayama, K. Wiege, P. Crocker, Y. Endo, N. Hogg, R. L. Wheat, D. J. Blackbourn, T. Irimura, Y. Uchiyama, A. Shigeta, A. Hamann, S. Floess, M. Sue, P. Sedlmayr, N. Tsukamoto, K. Katagiri, H. Elovaara, S. Yonekura, A. Kyusai

المصدر: International Immunology. 22:ii61-ii66

مصطلحات موضوعية: Immunology, Immunology and Allergy, General Medicine

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::af0a04b8f1b4e4bb64cf9854eff543cb
https://doi.org/10.1093/intimm/dxq115

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Application of a quadrupole mass filter to laser ionization mass spectrometry: synchronization between the laser pulse and the mass scan

المؤلفون: Hiroaki Sakanashi, Y. Ohoka, H. Katoh, Mikio Kuzuya

المصدر: Spectrochimica Acta Part B: Atomic Spectroscopy. 53:123-129

مصطلحات موضوعية: Chemistry, Analytical chemistry, Thermal ionization mass spectrometry, Mass spectrometry, Atomic and Molecular Physics, and Optics, Ion source, Analytical Chemistry, Triple quadrupole mass spectrometer, Atmospheric-pressure laser ionization, Secondary ion mass spectrometry, Physics::Atomic Physics, Atomic physics, Instrumentation, Quadrupole mass analyzer, Spectroscopy, Hybrid mass spectrometer

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::28bb54ecc6a9bc5b59f6fea2adb95c54
https://doi.org/10.1016/s0584-8547(97)00108-0

View record from ScienceDirect

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Regulation of thymocyte lineage commitment by the level of classical protein kinase C activity

المؤلفون: Y Ohoka, T Kuwata, A Asada, Y Zhao, M Mukai, M Iwata

المصدر: The Journal of Immunology. 158:5707-5716

مصطلحات موضوعية: Immunology, Immunology and Allergy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4f6a4fe08deb01627f577dc816f19230
https://doi.org/10.4049/jimmunol.158.12.5707

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Integration of High Performance and Low Cost Cu/Ultra Low-k SiOC(k=2.0) Interconnects with Self-formed Barrier Technology for 32nm-node and Beyond

المؤلفون: Shingo Kadomura, T. Hayashi, R. Kanamura, S. Arakawa, A. Isobayashi, Naoki Komai, Y. Ohoka, Y. Ohba

المصدر: 2007 IEEE International Interconnect Technology Conferencee.

مصطلحات موضوعية: Barrier layer, Materials science, business.industry, Thermal resistance, Electronic engineering, Degradation (geology), Optoelectronics, Node (circuits), Dielectric thin films, Conductivity, business, Electromigration, Hard mask

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b04eed85420e49ef601326486585fb1c
https://doi.org/10.1109/iitc.2007.382351

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[Extensive educational program for high performance medical technologists]

المؤلفون: S, Yorifuji, Y, Iwatani, S, Kawano, S, Inagaki, H, Sugiyama, N, Matsuura, T, Yamanura, Y, Yamamoto, T, Higashi, M, Horio, Y, Oji, H, Yamaguchi, M, Watanabe, N, Kawaguchi, Y, Ohoka, M, Hirata, M, Ishigami, H, Eguchi, Y, Hamada

المصدر: Rinsho byori. The Japanese journal of clinical pathology. 54(3)

مصطلحات موضوعية: Patient Care Team, Japan, Education, Professional, Point-of-Care Systems, Medical Laboratory Science, Curriculum

URL الوصول: https://explore.openaire.eu/search/publication?articleId=pmid________::7037651ad79f22b48d192c162d5eb1fe
https://pubmed.ncbi.nlm.nih.gov/16637580

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Breakthrough Integration of 32nm-node CulCntra Low-k SiOC (k=2.0) Interconnects by using Advanced Pore-Sealing and Low-k Hard Mask Technologies

المؤلفون: I. Mizuno, Shingo Kadomura, Y. Ohoka, Kazunori Nagahata, Kiyotaka Tabuchi, R. Kanamura, S. Arakawa

المصدر: 2006 International Interconnect Technology Conference.

مصطلحات موضوعية: Stress (mechanics), Materials science, business.industry, Etching (microfabrication), Stress migration, Electronic engineering, Optoelectronics, Degradation (geology), Node (circuits), Time-dependent gate oxide breakdown, business, Capacitance, Electromigration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8455ffedcadb694de1187c512cccf34d
https://doi.org/10.1109/iitc.2006.1648690

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Integration of Self-Formed Barrier Technology for 32nm-Node Cu Dual-Damascene Interconnects with Hybrid Low-k (PAr/SiOC) Structure

المؤلفون: K. Inoue, Naoki Komai, Y. Ohoka, Shingo Kadomura, S. Arakawa, R. Kanamura, T. Hayashi

المصدر: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers..

مصطلحات موضوعية: Interconnection, Materials science, Chemical substance, X-ray photoelectron spectroscopy, business.industry, Transmission electron microscopy, Analytical chemistry, Copper interconnect, Degradation (geology), Optoelectronics, business, Science, technology and society, Electromigration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8b8196fc9ddcce2a7d82e2ad060ae882
https://doi.org/10.1109/vlsit.2006.1705243

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Highly reliable Cu/low-k dual-damascene interconnect technology with hybrid (PAE/SiOC) dielectrics for 65 nm-node high performance eDRAM

المؤلفون: Atsuko Sakata, Akihiro Kajita, Kazunori Nagahata, Hideki Shibata, Y. Kato, H. Kawashima, Akihiro Kojima, Tomio Katata, Takamasa Usui, Kiyotaka Tabuchi, Masaki Yamada, R. Kanamura, Shingo Kadomura, E. Ogawa, Y. Ohoka, T. Hayashi, Hideshi Miyajima

المصدر: Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).

مصطلحات موضوعية: Permittivity, Mean time between failures, Materials science, business.industry, Sputtering, Electronic engineering, Copper interconnect, Optoelectronics, Dielectric, eDRAM, business, Electromigration, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0af1da2e6e6496012ca5d6c88da7430c
https://doi.org/10.1109/iitc.2003.1219697

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Integration of Cu/low-k dual-damascene interconnects with a porous PAE/SiOC hybrid structure for 65 nm-node high performance eDRAM

المؤلفون: Kiyotaka Tabuchi, Hideshi Miyajima, Kazunori Nagahata, T. Usui, A. Kajita, Masanaga Fukasawa, Y. Ohoka, Hideki Shibata, S. Shibuki, M. Muramatsu, Shingo Kadomura, R. Kanamura

المصدر: 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407).

مصطلحات موضوعية: Materials science, business.industry, Process integration, Copper interconnect, Electronic engineering, Optoelectronics, Degradation (geology), Dielectric, eDRAM, business, Porous medium, Porosity, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0607a8bc23400f79a4ae26a7e9dbc7f1
https://doi.org/10.1109/vlsit.2003.1221109

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New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallization

المؤلفون: Masao Ishihara, Hiizu Ohtorii, Zenya Yasuda, Takeshi Nogami, Shuzo Sato, Yuji Segawa, Kaori Tai, Y. Ohoka, Shingo Takahashi, Hiroshi Horikoshi, Naoki Komai

المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).

مصطلحات موضوعية: Materials science, Diffusion barrier, Annealing (metallurgy), business.industry, Metallurgy, Tantalum, chemistry.chemical_element, Chemical vapor deposition, Sputter deposition, Corrosion, Galvanic corrosion, chemistry, Optoelectronics, Surface layer, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b9812236813cf8c3a506c61eb46dff3e
https://doi.org/10.1109/iitc.2002.1014931

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