يعرض 1 - 10 نتائج من 70 نتيجة بحث عن '"Yamamuka, M."', وقت الاستعلام: 0.95s تنقيح النتائج
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    دورية أكاديمية

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 40(9):1487-1490 Sep, 2019

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    مؤتمر

    المصدر: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :16-16 Oct, 2021

    Relation: 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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    دورية أكاديمية

    المصدر: IEEE Journal of Photovoltaics IEEE J. Photovoltaics Photovoltaics, IEEE Journal of. 6(4):846-851 Jul, 2016

  4. 4
    مؤتمر

    المصدر: 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual Reliability physics Reliability Physics Symposium, 1997. 35th Annual Proceedings., IEEE International. :82-89 1997

    Relation: 1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual

  5. 5
    مؤتمر

    المصدر: Proceedings of International Electron Devices Meeting Electron devices Electron Devices Meeting, 1995. IEDM '95., International. :115-118 1995

    Relation: Proceedings of International Electron Devices Meeting

  6. 6
    مؤتمر

    المصدر: 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) VLSI technology VLSI Technology, 2000. Digest of Technical Papers. 2000 Symposium on. :106-107 2000

    Relation: 2000 Symposium on VLSI Technology. Digest of Technical Papers

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