المؤلفون: Shih, M. L., Shih, P. S., Huang, J. H., Chen, I. A., Wang, J. S., Ko, C. T., Lin, B. R., Yang, K. M., Lin, C. H., Lee, A. S., Kao, C. R.

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Lau, J.H., Ko, C.-T., Yang, K.-M., Peng, C.-Y., Xia, T., Lin, P.B., Chen, J.J., Huang, P.-C., Liu, H.N., Tseng, T.-J.

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :339-347 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Han, J. B., Yang, K. M., Kim, D. H., Seo, K. H.

المصدر: 2019 7th International Conference on Control, Mechatronics and Automation (ICCMA) Control, Mechatronics and Automation (ICCMA), 2019 7th International Conference on. :137-143 Nov, 2019

Relation: 2019 7th International Conference on Control, Mechatronics and Automation (ICCMA)

المؤلفون: Cheng, T.^{Aff1, Aff2}, Jing, J.^{Aff1, Aff2}, Yang, C. -Y.^{Aff1, Aff2}, Nie, D. -N.^{Aff1, Aff2}, Yang, K. -M.^{Aff1, Aff2}, Tang, S.^{Aff1, Aff2}, Fu, S. -X., Zhang, Y. -N., Zhou, Z. -X.^{Aff1, Aff2, ID2628_cor9}

المصدر: Journal of Structural Chemistry. 64(8):1369-1379

المؤلفون: Zhang, J., Guo, Y.-F., Pan, D.Z., Yang, K.-M., Lian, X.-J., Yao, J.-F.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(2):648-654 Feb, 2018

المؤلفون: Hou, Y. N., Yang, K. M., Song, J., Wang, H.^Aff2, Liu, Y.^Aff1, Fan, T. X.^Aff1

المصدر: Scientific Reports. 11(1)

المؤلفون: Peng, Y. Ch., Lv, T. H., Du, Zh. K., Cun, X. N., Yang, K. M.^Aff1

المصدر: Bulletin of Experimental Biology and Medicine. 170(1):40-45

المؤلفون: Kamm, C.A., Yang, K.-M., Shamieh, C.R., Singhal, S.

المصدر: Proceedings of 2nd IEEE Workshop on Interactive Voice Technology for Telecommunications Applications Interactive voice technology for telecommunications Interactive Voice Technology for Telecommunications Applications, 1994., Second IEEE Workshop on. :15-19 1994

Relation: Proceedings of 2nd IEEE Workshop on Interactive Voice Technology for Telecommunications Applications

المؤلفون: Oh, S. I., Kang, S. W., Yang, K. M., Kang, K. S.

المصدر: 2009 IEEE International Conference on Industrial Engineering and Engineering Management Industrial Engineering and Engineering Management, 2009. IEEM 2009. IEEE International Conference on. :1401-1405 Dec, 2009

Relation: 2009 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM)

المؤلفون: Yang, K.-M., Fujiwara, H., Sakaguchi, T., Shimazu, A.

المصدر: IEEE TENCON'90: 1990 IEEE Region 10 Conference on Computer and Communication Systems. Conference Proceedings Computer and Communication Systems, 1990. IEEE TENCON'90., 1990 IEEE Region 10 Conference on. :551-554 vol.2 1990

Relation: IEEE TENCON - 1990 IEEE Region 10 Conference on Computer and Communication Systems. Conference Proceedings