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1مؤتمر
المؤلفون: Chen, Pei-Chi, Su, Yen-Fu, Yang, Shin-Yueh, Chiang, Kuo-Ning
المصدر: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International. :83-86 Oct, 2011
Relation: 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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2مؤتمر
المؤلفون: Yang, Shin-Yueh, Chou, Tsung-Lin, Huang, Chien-Fu, Wu, Chung-Jung, Hsu, Chia-Liang, Chiang, Kuo-Ning
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International. :1-4 Oct, 2010
Relation: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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3مؤتمر
المؤلفون: Yang, Shin-Yueh, Chou, Tsung-Lin, Huang, Chien-Fu, Chung-Jung Wu, Chia-Liang Hsu, Chiang, Kuo-Ning
المصدر: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-5 Sep, 2010
Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)
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4مؤتمر
المؤلفون: Su, Yen-Fu, Hung, Tuan-Yu, Yang, Shin-Yueh, Chiang, Kuo-Ning
المصدر: 2010 IEEE CPMT Symposium Japan CPMT Symposium Japan, 2010 IEEE. :1-4 Aug, 2010
Relation: 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)
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5مؤتمر
المؤلفون: Masafumi Sano, Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Chao-Jen Huang, Chiang, Kuo-Ning
المصدر: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. :537-540 Oct, 2009
Relation: 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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6مؤتمرInvestigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis
المؤلفون: Chou, Chan-Yen, Hung, Tuan-Yu, Sano, Masafumi, Yang, Shin-Yueh, Chiang, Kuo-Ning
المصدر: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International. :185-188 Oct, 2008
Relation: 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT)
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7دورية أكاديمية
المؤلفون: Chen, Pei-Chi, Su, Yen-Fu, Yang, Shin-Yueh, Liang, Steven Y., Chiang, Kuo-Ning
المصدر: Journal of Electronic Materials. July 2015 44(7):2497-2506
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8دورية أكاديمية
المؤلفون: Yu, Tai-Ho, Yang, Shin-Yueh, Lee, Chen-Liang, Yin, Ching-Chung
المصدر: In Finite Elements in Analysis & Design 2011 47(7):635-642
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9دورية أكاديمية
المؤلفون: Chou, Tsung-Lin, Yang, Shin-Yueh, Chiang, Kuo-Ning
المصدر: In Thin Solid Films 2011 519(22):7883-7894
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10دورية أكاديمية
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