المؤلفون: Yang, Zhou, Yang, Yuchi, Lyu, Peijue, Du, Jianyu, Chen, Lang, Kang, Jin, Bu, Weihai, Zheng, Kai, Zhou, Yikang, Zhang, Chi, Wang, Wei

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2280-2285 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, Jiale^{Aff1, Aff2, IDs11042024199070_cor1}, Lian, Qiusheng^{Aff1, Aff2}, Zhang, Xinyu^{Aff1, Aff2}, Zhang, Dan^{Aff1, Aff2}, Yang, Yuchi^{Aff1, Aff2}

المصدر: Multimedia Tools and Applications: An International Journal. :1-19

المؤلفون: Chen, Guoqiang^{Aff1, Aff2}, Shen, Zhengyi^{Aff1, IDs1220602406356_cor2}, Tu, Weilong, Xu, Li, Li, Teng, Yang, Yuchi, Li, Shuangji

المصدر: Journal of Mechanical Science and Technology. 38(7):3615-3630

المؤلفون: Yang, Yuchi, Lyu, Peijue, Li, Motong, Yang, Zhou, Du, Jianyu, Zhang, Chi, Wang, Wei

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-8 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Du, Jianyu, Yang, Yuchi, Yu, Huaiqiang, Liu, Yulong, Kang, Jiajie, Wang, Wei

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Du, Jianyu, Yang, Yuchi, Yu, Huaiqiang, Xu, Han, Zheng, Deyin, Wang, Qi, Kang, Jiajie, Wang, Wei

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1805-1810 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhao, Haoran, Wang, Qi, Wen, Bo, Yang, Yuchi, Yue, Wen, Wang, Wei

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-3 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Du, Jianyu, Yang, Yuchi, Yu, Huaiqiang, Zheng, Deyin, Wang, Zetian, Kang, Jiajie, Wang, Wei

المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :493-496 Dec, 2021

Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

المؤلفون: Du, Jianyu, Li, Weihao, Gao, Xu, Zheng, Deyin, Yang, Yuchi, Wang, Zetian, Zhao, Haoran, Kang, Jiajie, Wang, Wei

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Yang, Yuchi, Chen, Jing, Wang, Wei, Wang, Mengcheng, Ma, Shenglin, Hu, Liulin, He, Shuwei

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)