المؤلفون: Otuka N., Pritychenko B., Fleming M., Jin Y., Pikulina G., Suzuki R., Devi V., Mikhailiukova M., Okumura S., Soppera N., Tada T., Takács S., Taova S., Varlamov V.V., Wang J.M., Yang S.C., Zerkin V.

المصدر: EPJ Web of Conferences, Vol 239, p 15001 (2020)

مصطلحات موضوعية: Physics, QC1-999

وصف الملف: electronic resource

Relation: https://www.epj-conferences.org/articles/epjconf/pdf/2020/15/epjconf_nd2019_15001.pdf; https://doaj.org/toc/2100-014X

URL الوصول: https://doaj.org/article/3ddce375ca57494891452047412694a2

المؤلفون: Liang, K., Feliciano, J.L., Marrone, K.A., Murray, J.C., Hann, C.L., Anagnostou, V., Tackett, S.A., Shin, E.J., Hales, R.K., Voong, K.R., Battafarano, R.J., Yang, S.C., Broderick, S.R., Ha, J.S., Forde, P.M., Brahmer, J.R., Lam, V.K.

المصدر: In ESMO Open January 2024 9(1)

المؤلفون: Yang, G.C., Yang, S.C., Jing, L., Kwok, C.Y., Sobral, Y.D.

المصدر: In Journal of Computational Physics 15 April 2023 479

المؤلفون: Yang, S.C., Wu, C.J., Hsiao, Y.L., Tung, C.H., Yu, Doug C.H.

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :859-864 May, 2015

Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, J.N., Yu, R., Ji, D.D., Tang, L.W., Yang, S.C., Fan, D.Q., Shui, Z.H., Leng, Y., Liu, K.N.

المصدر: In Cement and Concrete Composites January 2022 125

المؤلفون: Hong, H.P., Tang, Q., Yang, S.C., Cui, X.Z., Cannon, A.J., Lounis, Z., Irwin, P.

المصدر: In Structural Safety November 2021 93

المؤلفون: Yang, S.H., Sheu, J.Y., Ieong, M.K., Chiang, M.H., Yamamoto, T., Liaw, J.J., Chang, S.S., Lin, Y.M., Hsu, T.L., Hwang, J.R., Ting, J.K., Wu, C.H., Ting, K.C., Yang, F.C., Liu, C.M., Wu, I.L., Chen, Y.M., Chent, S.J., Chen, K.S., Cheng, J.Y., Tsai, M.H, Chang, W., Chen, R., Chen, C.C., Lee, T.L., Lin, C.K, Yang, S.C., Sheu, Y.M., Tzeng, J.T., Lu, L.C., Jang, S.M, Diaz, C.H., Mii, YJ

المصدر: 2011 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2011 IEEE. :1-5 Sep, 2011

Relation: 2011 IEEE Custom Integrated Circuits Conference - CICC 2011

المؤلفون: Yang, S.Q., Li, W.H., Yang, S.C.

المصدر: 2010 5th IEEE Conference on Industrial Electronics and Applications Industrial Electronics and Applications (ICIEA), 2010 the 5th IEEE Conference on. :1972-1975 Jun, 2010

Relation: 2010 5th IEEE Conference on Industrial Electronics and Applications (ICIEA)

المؤلفون: Ho, C.E., Lin, Y.W., Yang, S.C., Kao, C.R.

المصدر: Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on. :39-44 2005

Relation: 2005. 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

المؤلفون: Yatsui, K., Suematsu, H., Yang, S.C., Iwashita, R., Nagahama, T., Uchitomi, N., Jiang, W., Arikado, T.

المصدر: Conference Record of the Twenty-Fifth International Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Power modulator symposium and high-voltage workshop Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Conference Record of the Twenty-Fifth International. :540-543 2002

Relation: Conference Record of the Twenty-Fifth International Power Modulator Symposium and 2002 High-Voltage Workshop. International Power Modulator Conference