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المؤلفون: Amares Singh, Yap Tze Chuan, Ervina Efzan Mhd Noor
المصدر: Soldering & Surface Mount Technology. 25:229-241
مصطلحات موضوعية: Reliability (semiconductor), Materials science, Melting temperature, Soldering, Metallurgy, Electronic packaging, Shear strength, Nanoparticle, General Materials Science, Electrical and Electronic Engineering, Condensed Matter Physics, Microstructure, Solder alloy