المؤلفون: Chang, Vincent S., Wang, S. H., Lu, J. H., Wu, W. H., Wu, B. F., Hsu, B. C., Kwong, K. C., Yeh, J. Y., Chang, C. H., Chen, C. H., Chui, C. O., Yeh, M. S., Huang, K. B., Chen, R., Chen, K. S., Wu, S. Y.

المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020

Relation: 2020 IEEE Symposium on VLSI Technology

المؤلفون: Yeh, M.-S., Luo, G.-L., Hou, F.-J., Sung, P.-J., Wang, C.-J., Su, C.-J., Wu, C.-T., Huang, Y.-C., Hong, T.-C., Chao, T.-S., Chen, B.-Y., Chen, K.-M., Izawa, M., Miura, M., Morimoto, M., Ishimura, H., Lee, Y.-J., Wu, W.-F., Yeh, W.-K.

المصدر: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :205-207 Mar, 2018

Relation: 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM)

المؤلفون: Tang, Y.-T, Su, C.-J., Wang, Y.-S., Kao, K.-H., Wu, T.-L., Sung, P.-J., Hou, F.-J., Wang, C.-J., Yeh, M.-S., Lee, Y.-J., Wu, W.-F., Huang, G.-W., Shieh, J.-M., Yeh, W.-K., Wang, Y.-H.

المصدر: 2018 IEEE Symposium on VLSI Technology VLSI Technology, 2018 IEEE Symposium on. :45-46 Jun, 2018

Relation: 2018 IEEE Symposium on VLSI Technology

المؤلفون: Su, C.-J., Hong, T.-C., Tsou, Y.-C., Hou, F.-J., Sung, P.-J., Yeh, M.-S., Wan, C.-C., Kao, K.-H., Tang, Y.-T., Chiu, C.-H., Wang, C.-J., Chung, S.-T., You, T.-Y., Huang, Y.-C., Wu, C.-T., Lin, K.-L., Luo, G.-L., Huang, K.-P., Lee, Y.-J., Chao, T.-S., Wu, W.-F., Huang, G.-W., Shieh, J.-M., Yeh, W.-K., Wang, Y.-H.

المصدر: 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :15.4.1-15.4.4 Dec, 2017

Relation: 2017 IEEE International Electron Devices Meeting (IEDM)

المؤلفون: Lin, M.H., Lin, Y.L., Yang, G.S., Yeh, M.-S., Chang, K.P., Su, K.C., Tahui Wang

المصدر: Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the. :177-180 2004

Relation: Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004

المؤلفون: Lin, M.H., Lin, Y.L., Chen, J.M., Tsai, C.C., Yeh, M.-S., Liu, C.C., Hsu, S., Wang, C.H., Sheng, Y.C., Chang, K.P., Su, K.C., Chang, Y.J., Tahui Wang

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :229-233 2004

Relation: 2004 IEEE International Reliability Physics Symposium. Proceedings

المؤلفون: Yeh, M.-S., Lee, Y.-J., Hung, M.-F., Liu, K.-C., Wu, Y.-C.

المصدر: IEEE Transactions on Nanotechnology IEEE Trans. Nanotechnology Nanotechnology, IEEE Transactions on. 12(4):636-640 Jul, 2013

المؤلفون: Chang, M.-H., Wang, C., Lin, M.-C., Tsai, M.-H., Chang, L.-H., Yeh, M.-S., Yang, T.-Z., Lo, C.-H., Liu, C.-K., Chung, F.-T., Lin, Y.-H., Yu, T.-C., Chen, L.-J.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 21(3):1908-1913 Jun, 2011

المؤلفون: Lin, M.-C., Wang, C., Furuya, T., Yang, T.-T., Yeh, M.-S., Chang, L.-H., Liu, C.-K., Chung, F.-T., Tsai, M.-H., Chang, M.-H., Lin, Y.-H., Lo, C.-H., Yu, T.-C., Chen, L.-J.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 21(3):2605-2608 Jun, 2011

المؤلفون: Lin, Y.-R., Yang, Y.-Y., Lin, Y.-H., Kurniawan, E.D., Yeh, M.-S., Chen, L.-C., Wu, Y.-C.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 6:1187-1191 2018