يعرض 1 - 10 نتائج من 209 نتيجة بحث عن '"Yen, Yee-Wen"', وقت الاستعلام: 0.91s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Effects of Minor Ga Addition on Interfacial Reactions Between Sn-Ga Solders and Cu

    المؤلفون: Wang, Chao-hongAff1, IDs11837024064531_cor1, Li, Kuan-ting, Yen, Yee-wen

    المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 76(6):2731-2740

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  2. 2
    دورية أكاديمية
    Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder

    المؤلفون: Laksono, Andromeda Dwi, Shen, Yu-An, Chen, Ting, Yen, Yee-WenAff1, Aff3, IDs11837024064264_cor4

    المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 76(6):2754-2762

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  3. 3
    مؤتمر
    Study on Interfacial Reactions and Tensile Properties in the Sn/C1990 HP Systems

    المؤلفون: Laksono, Andromeda Dwi, Chou, Jing-Ting, Chiang, Tzu-Yang, Yen, Yee-Wen

    المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022

    Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Full Text Finder
    أضف إلى المفضلة
  4. 4
    مؤتمر
    Development of High Temperature Lead-free Solders in the Al-95Zn + xSn Systems

    المؤلفون: Laksono, Andromeda Dwi, Yen, Yee-Wen

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :197-198 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

    أضف إلى المفضلة
  5. 5
    مؤتمر
    Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples

    المؤلفون: Hu, Xin-Bin, Wen, Jun, Yen, Yee-Wen

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :223-224 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

    أضف إلى المفضلة
  6. 6
    مؤتمر
    Improving the Solder Wettability Via Atmospheric Plasma Technology

    المؤلفون: Kencana, Sagung Dewi, Kuo, Yu-Lin, Yen, Yee-Wen, Schellkes, Eckart, Chuang, Wallace

    المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2067-2071 May, 2019

    Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

    Full Text Finder
    أضف إلى المفضلة
  7. 7
    دورية أكاديمية
    Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples

    المؤلفون: Laksono, Andromeda Dwi, Al-Audhah, Lutfi Yunus Wahab, Chen, Chih-Ming, Ho, Yu Xuan, Yen, Yee-WenAff1, IDs11837023058271_cor5

    المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 75(6):1889-1901

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
    أضف إلى المفضلة
  8. 8
    دورية أكاديمية
    Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples

    المؤلفون: Yen, Yee-Wen, Laksono, Andromeda Dwi, Liou, Yi-Chin, Ramadhani, Mavindra, Lee, Yu-Yen, Huang, Ssu-Chi

    المصدر: In Journal of the Taiwan Institute of Chemical Engineers February 2024 155

    View record from ScienceDirect Full Text Finder
    أضف إلى المفضلة
  9. 9
    مؤتمر
    Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) couple

    المؤلفون: Chang, Jing-Shiun, Yen, Yee-Wen

    المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :97-101 Apr, 2018

    Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

    Full Text Finder
    أضف إلى المفضلة
  10. 10
    مؤتمر
    Phase equilibria of the Sn-Ni-W ternary system at 750 °C

    المؤلفون: Hermana, Gita Novian, Chang, Yen-Wei, Chen, Pei-Yu, Chiu, Chao-Wei, Yen, Yee-wen

    المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :201-204 Oct, 2016

    Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

    Full Text Finder
    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء