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1دورية أكاديمية
المؤلفون: Wang, Chao-hongAff1, IDs11837024064531_cor1, Li, Kuan-ting, Yen, Yee-wen
المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 76(6):2731-2740
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2دورية أكاديمية
المؤلفون: Laksono, Andromeda Dwi, Shen, Yu-An, Chen, Ting, Yen, Yee-WenAff1, Aff3, IDs11837024064264_cor4
المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 76(6):2754-2762
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3مؤتمر
المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022
Relation: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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4مؤتمر
المؤلفون: Laksono, Andromeda Dwi, Yen, Yee-Wen
المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :197-198 Apr, 2023
Relation: 2023 International Conference on Electronics Packaging (ICEP)
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5مؤتمر
المؤلفون: Hu, Xin-Bin, Wen, Jun, Yen, Yee-Wen
المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :223-224 May, 2022
Relation: 2022 International Conference on Electronics Packaging (ICEP)
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6مؤتمر
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2067-2071 May, 2019
Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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7دورية أكاديمية
المؤلفون: Laksono, Andromeda Dwi, Al-Audhah, Lutfi Yunus Wahab, Chen, Chih-Ming, Ho, Yu Xuan, Yen, Yee-WenAff1, IDs11837023058271_cor5
المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 75(6):1889-1901
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8دورية أكاديميةSolid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples
المؤلفون: Yen, Yee-Wen, Laksono, Andromeda Dwi, Liou, Yi-Chin, Ramadhani, Mavindra, Lee, Yu-Yen, Huang, Ssu-Chi
المصدر: In Journal of the Taiwan Institute of Chemical Engineers February 2024 155
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9مؤتمر
المؤلفون: Chang, Jing-Shiun, Yen, Yee-Wen
المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :97-101 Apr, 2018
Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
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10مؤتمر
المؤلفون: Hermana, Gita Novian, Chang, Yen-Wei, Chen, Pei-Yu, Chiu, Chao-Wei, Yen, Yee-wen
المصدر: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :201-204 Oct, 2016
Relation: 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)