المؤلفون: Yeh, Shu-Shen, Lin, P. Y., Hsu, C. K., Lin, Y. S., Wang, J. H., Lai, P. C., Chen, C. H., Lee, Y. C., Yew, M. C., Cheng, S. K., Jeng, Shin-Puu

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :965-970 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Lin, Po-Yao, Yew, M. C., Yeh, S. S., Chen, S. M., Lin, C. H., Chen, C. S., Hsieh, C. C., Lu, Y. J., Chuang, P. Y., Cheng, H. K., Jeng, Shin-Puu

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :723-728 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Yeh, Shu-Shen, Lin, P. Y., Hsu, C. K., Lin, Y. S., Wang, J. H., Lai, P. C., Liao, L. L., Lee, T. Y., Chen, C. H., Yew, M. C., Cheng, S. K., Jeng, Shin-Puu

المصدر: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :1-4 Oct, 2020

Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

المؤلفون: Chuang, Po-Yao, Lin, M.-L., Hung, S.-T., Wu, Y.-W., Wong, D.-C., Yew, M.-C., Hsu, C.-K., Liao, L.-L, Lai, P.-Y., Tsai, P.-H., Chen, S.-M., Cheng, S.-K., Jeng, Shin-Puu

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :333-338 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yeh, Shu-Shen, Lin, P. Y., Lee, K. C., Yew, M. C., Yang, C. C., Wang, J. H., Hsu, C. K., Lai, P. C., Tseng, Dion, Cheng, S. K., Jeng, Shin-Puu

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1081-1086 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yeh, Shu-Shen, Lin, P. Y., Yew, M. C., Lin, W. Y., Lee, K. C., Yang, C. C., Wang, J. H., Lai, P. C., Hsu, C. K., Jeng, Shin-Puu

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1550-1555 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yew, M.-C., Yuan, C. C. A., Wu, C.-J., Hu, D.-C., Yang, W.-K., Chiang, K.-N.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 32(2):390-398 May, 2009

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Yew, M K, Yew, M C, Beh, J H, Saw, L H, Lee, Y L, Lim, J H, T, C Y

المصدر: IOP Conference Series: Earth & Environmental Science; 12/1/2021, Vol. 920, p1-7, 7p