المؤلفون: Lin, Yi-Sheng, Hsiao, Yu-Hsiang, Liu, Cheng-Hsin, Hsiao, Fan-Ju, Wang, Chen-Chao, Hung, Chin-Pin

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1804-1807 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chong, Yi Sheng, Cao, Hongyu, Goh, Wang Ling, Bore, Patrick, Tan, Yuanzheng Paul, Szen Yap, Yung, Dumke, Rainer, Nambiar, Vishnu P., Tuan Do, Anh

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Chong, Yi Sheng, Harish, Rakshith, Panicker, Rajesh Chandrasekhara, Nambiar, Vishnu P., Do, Anh Tuan

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Hsu, Yi-Sheng, Feldhus, Nils, Hakimov, Sherzod

مصطلحات موضوعية: Computer Science - Computation and Language

URL الوصول: http://arxiv.org/abs/2407.01384

المؤلفون: Gault, Baptiste, Saksena, Aparna, Sauvage, Xavier, Bagot, Paul, Aota, Leonardo S., Arlt, Jonas, Belkacemi, Lisa T., Boll, Torben, Chen, Yi-Sheng, Daly, Luke, Djukic, Milos B., Douglas, James O., Duarte, Maria J., Felfer, Peter J., Forbes, Richard G., Fu, Jing, Gardner, Hazel M., Gemma, Ryota, Gerstl, Stephan S. A., Gong, Yilun, Hachet, Guillaume, Jakob, Severin, Jenkins, Benjamin M., Jones, Megan E., Khanchandani, Heena, Kontis, Paraskevas, Krämer, Mathias, Kühbach, Markus, Marceau, Ross K. W., Mayweg, David, Moore, Katie L., Nallathambi, Varatharaja, Ott, Benedict C., Poplawsky, Jonathan D, Prosa, Ty, Pundt, Astrid, Saha, Mainak, Schwarz, Tim M., Shang, Yuanyuan, Shen, Xiao, Vrellou, Maria, Yu, Yuan, Zhao, Yujun, Zhao, Huan, Zou, Bowen

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2405.13158

المؤلفون: Lin, Yu-Ting, Liu, Cheng-Hsin, Lin, Yi-Sheng, Hsiao, Yu-Hsiang

المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :346-349 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Granqvist, Filip, Song, Congzheng, Cahill, Áine, van Dalen, Rogier, Pelikan, Martin, Chan, Yi Sheng, Feng, Xiaojun, Krishnaswami, Natarajan, Jina, Vojta, Chitnis, Mona

مصطلحات موضوعية: Computer Science - Machine Learning, Computer Science - Artificial Intelligence, Computer Science - Cryptography and Security, Computer Science - Computer Vision and Pattern Recognition

URL الوصول: http://arxiv.org/abs/2404.06430

المؤلفون: Koda, Yuya, Ozawa, Makoto, Wang, Yi-Sheng

مصطلحات موضوعية: Mathematics - Geometric Topology, 57M50 (Primary) 57M15, 57K12 (Secondary)

URL الوصول: http://arxiv.org/abs/2404.04503

المؤلفون: Su, Na, Liu, Shuang, He, Yingjie, Liu, Yan, Fu, Huixia, Chai, Yi-Sheng, Sun, Young

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2403.04244

المؤلفون: Wang, Yi-Sheng, Teng, Hsiang-Kai, Huang, Shi-Yu

المصدر: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2023 IEEE 66th International Midwest Symposium on. :792-796 Aug, 2023

Relation: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)