-
1دورية أكاديمية
المؤلفون: Robert Tseng, Sung-Tsun Wang, Tanveer Ahmed, Yi-Yu Pan, Shih-Chieh Chen, Che-Chi Shih, Wu-Wei Tsai, Hai-Ching Chen, Chi-Chung Kei, Tsung-Te Chou, Wen-Ching Hung, Jyh-Chen Chen, Yi-Hou Kuo, Chun-Liang Lin, Wei-Yen Woon, Szuya Sandy Liao, Der-Hsien Lien
المصدر: Nature Communications, Vol 14, Iss 1, Pp 1-8 (2023)
مصطلحات موضوعية: Science
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2041-1723
-
2دورية أكاديمية
المؤلفون: Po-Chih Chen, Wen-Chien Miao, Tanveer Ahmed, Yi-Yu Pan, Chun-Liang Lin, Shih-Chen Chen, Hao-Chung Kuo, Bing-Yue Tsui, Der-Hsien Lien
المصدر: Nanoscale Research Letters, Vol 17, Iss 1, Pp 1-17 (2022)
مصطلحات موضوعية: SiC, Killer defect, Defect inspection technology, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
Relation: https://doaj.org/toc/1556-276X
-
3
المؤلفون: Ming-Wei Weng, Kuma Hsiung, Hsin Chi Chang, Yi-Yu Pan, Han-Wen Hu, Arvind Sundarrajan, Tzu-Chieh Chou, Demin Liu, Yuan-Chiu Huang, Kuan-Neng Chen
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Metal, Yield (engineering), Materials science, Passivation, Scanning electron microscope, visual_art, Plating, visual_art.visual_art_medium, Electrical measurements, Composite material, Electroplating, Temperature measurement
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::553af0b5999e5391d93db296bcc6f16f
https://doi.org/10.1109/ectc32696.2021.00070