المؤلفون: Abroshan, M., Yip, K.H., Tekin, C., van der Schaar, M.

المصدر: IEEE Transactions on Neural Networks and Learning Systems IEEE Trans. Neural Netw. Learning Syst. Neural Networks and Learning Systems, IEEE Transactions on. 34(9):6368-6378 Sep, 2023

المؤلفون: Yip, K.H., Ang, P. C., Lee, K. F., Khoo, L. H.

المصدر: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-4 Sep, 2021

Relation: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Moon, SJ., Quah, A.C.T., Nagalingam, D., Yip, K.H., Chen, C.Q., Tam, Y.S., Ng, P.T., Ng, HP., Ang, G.B., Lam, J.C., Mai, Z.H.

المصدر: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Ng, P.T., Chen, C.Q., Tam, Y.S., Yip, K.H., Teo, Angela, Ang, G.H., Mai, Z.H., Lam, Jeffrey

المصدر: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Boon, A.G., Chen, C., Zhao, S.P., Neo, S.P., Yip, K.H., Loh, S.K., Ng, H.P., Teo, A., Ng, P.T.

المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :177-181 Jul, 2013

Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Chen, C.Q., Ang, G.B., Zhao, S.P., Ng, H.P., Loh, S.K., Yip, K.H.

المصدر: Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :289-292 Jul, 2013

Relation: 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Yoon, S.F., Yip, K.H., Zheng, H.Q., Gay, B.P.

المصدر: Conference Proceedings. 2001 International Conference on Indium Phosphide and Related Materials. 13th IPRM (Cat. No.01CH37198) Indium phosphide and related materials Indium Phosphide and Related Materials, 2001. IPRM. IEEE International Conference On. :338-341 2001

Relation: Conference Proceedings. 2001 International Conference on Indium Phosphide and Related Materials. 13th IPRM

المؤلفون: Yip, K.H., Xue Ming

المصدر: 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :410-412 2002

Relation: Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002)

المؤلفون: Chen, C.Q., Ang, G.B., Ng, P.T., Rivai, Francis, Neo, S.P., Nagalingam, D., Yip, K.H., Lam, Jeffery, Mai, Z.H.

المصدر: In Microelectronics Reliability September 2017 76-77:141-144

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