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1دورية أكاديمية
المؤلفون: Xiao Lu, Liang Zhang, Yong-huan Guo, Li-Yin Gao, Xi Wang, Chen Chen, Zhi-Quan Liu
المصدر: Journal of Materials Research and Technology, Vol 25, Iss , Pp 3754-3767 (2023)
مصطلحات موضوعية: SiC nanowires, Nanocrystalline Cu, Interfacial reaction, 3D packing, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Yong-huan Guo
المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 514-526 (2023)
مصطلحات موضوعية: Sn58Bi solder, Mg particles, Solder joints, Interfacial IMC, Mechanical properties, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Yong-huan Guo
المصدر: Journal of Materials Research and Technology, Vol 24, Iss , Pp 3643-3656 (2023)
مصطلحات موضوعية: Sn58Bi solder, B4C nanoparticles, Transient liquid phase bonding, Intermetallic compound evolution, Mechanical properties, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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4دورية أكاديمية
المؤلفون: Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Li-li Gao, Meng Zhao, Yong-huan Guo
المصدر: Journal of Materials Research and Technology, Vol 23, Iss , Pp 1225-1238 (2023)
مصطلحات موضوعية: Sn58Bi solder, B4C nanoparticles, Solder joint, Mechanical properties, Microstructure, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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5دورية أكاديمية
المؤلفون: Xi Wang, Liang Zhang, Xiao Wang, Yong-huan Guo, Lei Sun, Ying-xia Liu, Chen Chen, Xiao Lu
المصدر: Journal of Materials Research and Technology, Vol 21, Iss , Pp 4263-4280 (2022)
مصطلحات موضوعية: Sn58Bi, IMC, AlN nanoparticles, Phase field simulation, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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6
المؤلفون: Liu Xin, Hai Yue Huang, Yong Huan Guo, Lu Lu Li, Li Sai, Yan Li Cao, Fan Xiying
المصدر: Arabian Journal for Science and Engineering. 46:11835-11845
مصطلحات موضوعية: Accuracy and precision, Mathematical optimization, Multidisciplinary, Basis (linear algebra), Computer science, business.industry, Reliability (computer networking), 010102 general mathematics, Process (computing), Molding (process), 01 natural sciences, Nonlinear system, Kriging, 0101 mathematics, Computer-aided engineering, business
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7
المؤلفون: Xi-ying Fan, Yong-huan Guo, Jin-Yue Zhao, Yan Tian, Liang Zhang, Huang Chuanqi
المصدر: Welding in the World. 65:563-572
مصطلحات موضوعية: 0209 industrial biotechnology, Materials science, Precipitation (chemistry), Bainite, Mechanical Engineering, Weldability, Metals and Alloys, 02 engineering and technology, Microstructure, 020501 mining & metallurgy, Carbide, 020901 industrial engineering & automation, Brittleness, 0205 materials engineering, Mechanics of Materials, Solid mechanics, Fracture (geology), Composite material
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8
المؤلفون: Jingjing Wu, Yong-huan Guo, Yan Tian, Xi-ying Fan, Jin Yu
المصدر: Materials Research Express. 6:126585
مصطلحات موضوعية: Heat-affected zone, Fabrication, Materials science, Polymers and Plastics, Metallurgy, Metals and Alloys, Welding, Crystal structure, Microstructure, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, law.invention, Biomaterials, Rockwell scale, law, Grain boundary, Crystallization
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9
المؤلفون: Yong-huan Guo, Lei Sun, Liang Zhang
المصدر: Journal of Materials Science: Materials in Electronics. 26:7629-7634
مصطلحات موضوعية: Thermal fatigue, Mechanical property, Materials science, Metallurgy, Intermetallic, Condensed Matter Physics, Microstructure, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Phase (matter), Soldering, Ultimate tensile strength, Wetting, Electrical and Electronic Engineering, Composite material
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10
المؤلفون: Yong-huan Guo, Liang Zhang, Lei Sun, Ji-guang Han
المصدر: Journal of Materials Science: Materials in Electronics. 26:6194-6197
مصطلحات موضوعية: animal structures, Materials science, integumentary system, business.industry, Whiskers, Metallurgy, Electronic packaging, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Whisker, Soldering, Microelectronics, Growth rate, Electrical and Electronic Engineering, business