المؤلفون: Kyu-Sul Park, Sang-Jin Kim, In-Bok Baek, Won-Hee Lee, Jong-Seuk Kang, Yong-Bum Jo, Sang Don Lee, Chang-Keun Lee, Jung-Bum Choi, Jang-Han Kim, Keun-Hyung Park, Won-Ju Cho, Moon-Gyu Jang, Seong-Jae Lee

المصدر: IEEE Transactions on Nanotechnology IEEE Trans. Nanotechnology Nanotechnology, IEEE Transactions on. 4(2):242-248 Mar, 2005

المؤلفون: Jongwoo Park, Back-Sung Kim, Hyun-Jun Cha, Yong-Bum Jo, Sang-Chul Shin, Gun-Rae Kim, June-Kyun Park, Man-Young Shin, Kyung-Il Ouh, Hyun-Goo Jeon

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :569-570 2004

Relation: 2004 IEEE International Reliability Physics Symposium. Proceedings

المؤلفون: Yong-Bum Jo, Jongwoo Park, Chul-Hee Jeon, Kyung-Il Ouh, Hyun-Goo Jeon

المصدر: 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :629-630 2004

Relation: 2004 IEEE International Reliability Physics Symposium. Proceedings

المؤلفون: Lee So Hyoun, Yong-Bum Jo, Taeseok Park, Jong-Ju Ahn, Huh Jung Bo

المصدر: The Korean Academy of Oral and Maxillofacial Implantology. 24:76-82

مصطلحات موضوعية: Materials science, Bonding strength, Bond strength, Slurry, Resin bonding, Cubic zirconia, Surface finish, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a21ccca68206ad2467d8dfd92d0230d2
https://doi.org/10.32542/implantology.202008

المؤلفون: Min-Jung Kim, Jung-Bo Huh, Chang-Mo Jeong, Mi-Jung Yun, So-Hyoun Lee, Yong-Bum Jo

المصدر: The Journal of Korean Academy of Prosthodontics. 60:71

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::350457027407f87282cd4264544842c5
https://doi.org/10.4047/jkap.2022.60.1.71

المؤلفون: Yong-Bum Jo, Chang-Mo Jeong, Jung-Bo Huh, Mi-Jung Yun, So-Hyoun Lee, Min-Jung Kim

المصدر: The Journal of Korean Academy of Prosthodontics. 60:160

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::69842f28d5e7fccea389000052a22379
https://doi.org/10.4047/jkap.2022.60.2.160

المؤلفون: Gunrae Kim, Jongwoo Park, Yong-Bum Jo, Junekyun Park

المصدر: IEEE Transactions on Device and Materials Reliability. 8:368-374

مصطلحات موضوعية: Resistive touchscreen, Auger electron spectroscopy, Materials science, Electronic packaging, Analytical chemistry, Molding (process), Electronic, Optical and Magnetic Materials, Stress (mechanics), Dendrite (crystal), Adhesive, Electrical and Electronic Engineering, Quad Flat Package, Composite material, Safety, Risk, Reliability and Quality

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::af830661016b4f100aaf246bd4580cf9
https://doi.org/10.1109/tdmr.2008.919578

المؤلفون: Hyun-Goo Jeon, Kyung-Il Ouh, Junekyun Park, Jongwoo Park, Yong-Bum Jo

المصدر: IEEE Transactions on Components and Packaging Technologies. 30:724-730

مصطلحات موضوعية: Void (astronomy), Materials science, Compressive strength, High-temperature operating life, Electronic engineering, Extrusion, Electrical and Electronic Engineering, Composite material, Quad Flat Package, Circuit reliability, Electromigration, Electronic, Optical and Magnetic Materials, Stress concentration

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b3f68f6e386d97cf75621b0ecd21d5fe
https://doi.org/10.1109/tcapt.2007.906322

المؤلفون: Junekyun Park, Hyun-Goo Jeon, Sam-Young Kim, Man-Young Shin, Kyung-Il Ouh, Sang-Cheol Shin, Back-Sung Kim, Hyun-Joon Cha, Jongwoo Park, Yong-Bum Jo

المصدر: IEEE Transactions on Components and Packaging Technologies. 30:731-744

مصطلحات موضوعية: Wire bonding, Auger electron spectroscopy, Materials science, Cost effectiveness, Alloy, Metallurgy, Intermetallic, Epoxy, Molding (process), engineering.material, Electronic, Optical and Magnetic Materials, visual_art, visual_art.visual_art_medium, engineering, Surface roughness, Electrical and Electronic Engineering, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0c8ff73e995162b26ee4139f58469a18
https://doi.org/10.1109/tcapt.2007.906318

المؤلفون: Seongjae Lee, Sang-Jin Kim, Jung-Bum Choi, Jang-Han Kim, Moongyu Jang, Yong-Bum Jo, In-Bok Baek, Jong-Seuk Kang, Chang Keun Lee, Won-Ju Cho, Won-Hee Lee, Kyu-Sul Park, Keun-Hyung Park, Sang Don Lee

المصدر: IEEE Transactions On Nanotechnology. 4:242-248

مصطلحات موضوعية: Power gain, Materials science, business.industry, Transistor, Electrical engineering, Integrated circuit, RC time constant, Computer Science Applications, law.invention, Hybrid integrated circuit, Nanoelectronics, law, Logic gate, Optoelectronics, Field-effect transistor, Electrical and Electronic Engineering, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::cc8a2891e5456f72d1b937237d467b82
https://doi.org/10.1109/tnano.2004.837857