المؤلفون: Jang, Ki-Seok, Eom, Yong-Sung, Choi, Gwang-Mun, Joo, Jiho, Oh, Jin-Hyuk, Lee, Chan-Mi, Moon, Yoon-Hwan, Moon, Seok-Hwan, Choi, Kwang-Seong

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Choi, Kwang-Seong, Joo, Jiho, Choi, Gwang-Mun, Lee, Chanmi, Jang, Ki-Seok, Oh, Jin-Hyuk, Shin, Jungho, Yun, Ho-Gyeong, Moon, Seok Hwan, Moon, Yoon-Hwan, Eom, Yong-Sung

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1385-1389 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Moon, Yoon Hwan, Joo, Jiho, Choi, Gwang-Mun, Lee, Chanmi, Jang, Ki-Seok, Oh, Jin Hyuk, Oh, Yong-Jun, Eom, Yong-Sung, Choi, Kwang-Seong

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :01-06 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Kim, Kyung Hyun, Kim, Jeong Min, Baek, Ju Hye, Jeong, Sang Eun, Kim, Hocheol, Yoon, Hwan Su, Jeon, Che Ok^{Aff2, IDs4299502400227z_cor7}

المصدر: Marine Life Science & Technology. 6(2):298-314

المؤلفون: Park, Taekeun, Byun, Ja Min, Shin, Dong-Yeop, Koh, Youngil, Hong, Junshik, Yoon, Sung-Soo, Chang, Yoon Hwan^{Aff2, Aff3, IDs0027702305575x_cor7}, Kim, Inho^{Aff1, IDs0027702305575x_cor8}

المصدر: Annals of Hematology. 103(4):1235-1240

المؤلفون: Choi, Kwang-Seong, Joo, Jiho, Choi, Gwang-Mun, Yun, Ho-Gyeong, Moon, Seok Hwan, Jang, Ki-seok, Lee, Chanmi, Oh, Jin-Hyuk, Kye, In-Seok, Moon, Yoon-Hwan, Eom, Yong-Sung

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :198-203 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: Lhee, Duckhyun^Aff4, Bhattacharya, Debashish^Aff5, Yoon, Hwan Su^Aff4

المساهمون: Schwartzbach, Steven D., editor^Aff1, Kroth, Peter G., editor^Aff2, Oborník, Miroslav, editor^Aff3

المصدر: Endosymbiotic Organelle Acquisition : Solutions to the Problem of Protein Localization and Membrane Passage. :3-38

المؤلفون: Byun, Yoon Hwan, Won, Jae-Kyung, Hong, Duk Hyun, Kang, Ho, Kim, Jang Hun, Yu, Mi Ok, Kim, Min-Sung, Kim, Yong Hwy, Park, Kyung-Jae, Jeong, Min-Jae, Hwang, Kyungmin, Kong, Doo-Sik, Park, Chul-Kee, Kang, Shin-Hyuk^{Aff3, IDs41598024645404_cor14}

المصدر: Scientific Reports. 14(1)

المؤلفون: Byun, Yoon Hwan, Won, Jae-Kyung, Hong, Duk Hyun, Kang, Ho, Kim, Jang Hun, Yu, Mi Ok, Kim, Min-Sung, Kim, Yong Hwy, Park, Kyung-Jae, Jeong, Min-Jae, Hwang, Kyungmin, Kong, Doo-Sik, Park, Chul-Kee, Kang, Shin-Hyuk^{Aff3, IDs41598024524946_cor14}

المصدر: Scientific Reports. 14(1)

المؤلفون: Chakma, Palash, Zhao, Hongwu, Jeon, Junho, Choi, Yoon Hwan, Lee, Yeon Won^{Aff5, IDs122060240221y_cor5}

المصدر: Journal of Mechanical Science and Technology. 38(3):1259-1270