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1مؤتمر
المؤلفون: Jang, Ki-Seok, Eom, Yong-Sung, Choi, Gwang-Mun, Joo, Jiho, Oh, Jin-Hyuk, Lee, Chan-Mi, Moon, Yoon-Hwan, Moon, Seok-Hwan, Choi, Kwang-Seong
المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023
Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
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2مؤتمر
المؤلفون: Choi, Kwang-Seong, Joo, Jiho, Choi, Gwang-Mun, Lee, Chanmi, Jang, Ki-Seok, Oh, Jin-Hyuk, Shin, Jungho, Yun, Ho-Gyeong, Moon, Seok Hwan, Moon, Yoon-Hwan, Eom, Yong-Sung
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1385-1389 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3مؤتمرMicro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process
المؤلفون: Moon, Yoon Hwan, Joo, Jiho, Choi, Gwang-Mun, Lee, Chanmi, Jang, Ki-Seok, Oh, Jin Hyuk, Oh, Yong-Jun, Eom, Yong-Sung, Choi, Kwang-Seong
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :01-06 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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4دورية أكاديمية
المؤلفون: Kim, Kyung Hyun, Kim, Jeong Min, Baek, Ju Hye, Jeong, Sang Eun, Kim, Hocheol, Yoon, Hwan Su, Jeon, Che OkAff2, IDs4299502400227z_cor7
المصدر: Marine Life Science & Technology. 6(2):298-314
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5دورية أكاديمية
المؤلفون: Park, Taekeun, Byun, Ja Min, Shin, Dong-Yeop, Koh, Youngil, Hong, Junshik, Yoon, Sung-Soo, Chang, Yoon HwanAff2, Aff3, IDs0027702305575x_cor7, Kim, InhoAff1, IDs0027702305575x_cor8
المصدر: Annals of Hematology. 103(4):1235-1240
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6مؤتمر
المؤلفون: Choi, Kwang-Seong, Joo, Jiho, Choi, Gwang-Mun, Yun, Ho-Gyeong, Moon, Seok Hwan, Jang, Ki-seok, Lee, Chanmi, Oh, Jin-Hyuk, Kye, In-Seok, Moon, Yoon-Hwan, Eom, Yong-Sung
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :198-203 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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7كتاب إلكتروني
المؤلفون: Lhee, DuckhyunAff4, Bhattacharya, DebashishAff5, Yoon, Hwan SuAff4
المساهمون: Schwartzbach, Steven D., editorAff1, Kroth, Peter G., editorAff2, Oborník, Miroslav, editorAff3
المصدر: Endosymbiotic Organelle Acquisition : Solutions to the Problem of Protein Localization and Membrane Passage. :3-38
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8دورية أكاديمية
المؤلفون: Byun, Yoon Hwan, Won, Jae-Kyung, Hong, Duk Hyun, Kang, Ho, Kim, Jang Hun, Yu, Mi Ok, Kim, Min-Sung, Kim, Yong Hwy, Park, Kyung-Jae, Jeong, Min-Jae, Hwang, Kyungmin, Kong, Doo-Sik, Park, Chul-Kee, Kang, Shin-HyukAff3, IDs41598024645404_cor14
المصدر: Scientific Reports. 14(1)
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9دورية أكاديمية
المؤلفون: Byun, Yoon Hwan, Won, Jae-Kyung, Hong, Duk Hyun, Kang, Ho, Kim, Jang Hun, Yu, Mi Ok, Kim, Min-Sung, Kim, Yong Hwy, Park, Kyung-Jae, Jeong, Min-Jae, Hwang, Kyungmin, Kong, Doo-Sik, Park, Chul-Kee, Kang, Shin-HyukAff3, IDs41598024524946_cor14
المصدر: Scientific Reports. 14(1)
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10دورية أكاديمية
المؤلفون: Chakma, Palash, Zhao, Hongwu, Jeon, Junho, Choi, Yoon Hwan, Lee, Yeon WonAff5, IDs122060240221y_cor5
المصدر: Journal of Mechanical Science and Technology. 38(3):1259-1270