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1مؤتمر
المؤلفون: Soo-Geun Lee, Kyoung-Woo Lee, Il-Goo Kim, Wan-Jae Park, Young-Jin Wee, Won-Sang Song, Jae-Hak Kim, Seung-Jin Lee, Hyeok-Sang Oh, Yong-Tak Lee, Joo-Hyuk Chung, Ho-kyu Kang, Kwang-Pyuk Suh
المصدر: Digest. International Electron Devices Meeting, Electron devices meeting Electron Devices Meeting, 2002. IEDM '02. International. :591-594 2002
Relation: IEEE International Electron Devices Meeting
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2مؤتمر
المؤلفون: Young-Jin Wee, Ki-Chul Park, Won-Sang Song, Hyeon-Deok Lee, Wo-Kyu Kang, Joo-Tae Moon
المصدر: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) Interconnect technology conference Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International. :260-262 2001
Relation: Proceedings of the IEEE 2001 International Interconnect Technology Conference
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3مؤتمر
المؤلفون: Dong-Chul Kwon, Young-Jin Wee, Yun-Ho Park, Hyeon-Deok Lee, Ho-Kyu Kang, Moon-Yong Lee
المصدر: Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :143-145 1999
Relation: Proceedings of the IEEE 1999 International Interconnect Technology Conference
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4مؤتمر
المؤلفون: Young Jin Wee, Soo Geun Lee, Won Sang Song, Kyoung-Woo Lee, Nam Hyung Lee, Ja Eung Ku, Ki-Kwan Park, Seung Jin Lee, Jae Hak Kim, Joo Hyuk Chung, Hong Jae Shin, Sang Rok Hah, Ho-Kyu Kang, Gwang Pyuk Suh
المصدر: IEEE International Electron Devices Meeting 2003 Electron devices IEDM'03 Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International. :21.7.1-21.7.4 2003
Relation: IEEE International Electron Devices Meeting 2003
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5
المؤلفون: Nae In Lee, Jung-Shik Heo, Kyoung-Woo Lee, Seung-Jin Lee, Jae-Hak Kim, Jae-ouk Choo, S. W. Nam, Hong Jae Shin, Seung Man Choi, Keeyoung Jun, Woon Hyuk Choi, Young Jin Wee, Andrew-tae Kim, Jae Yeol Maeng, Lee Jungeun
المصدر: 2007 IEEE International Interconnect Technology Conferencee.
مصطلحات موضوعية: Acceleration, Interconnection, Materials science, Proximity effect (audio), Electronic engineering, Node (circuits), Dielectric, Activation energy, Composite material, Electromigration, Current density
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a5907245d224b4ff5faca7441710ecd0
https://doi.org/10.1109/iitc.2007.382343 -
6
المؤلفون: Jung-eun Lee, Soo-Geun Lee, Seung-Man Choi, Young-Jin Wee, Ho-Kyu Kang, Bong-seok Suh, Kwang-Pyuk Suh, Nae-In Lee, Hong-jae Shin, Sun-jung Lee, Jun-Ho Lee
المصدر: Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..
مصطلحات موضوعية: Materials science, Electrical resistance and conductance, Diffusion barrier, Annealing (metallurgy), Alloy, Metallurgy, Zirconium alloy, engineering, Titanium alloy, engineering.material, Nitride, Electromigration
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1dff410734d5403c23badc4ff8f3e5c7
https://doi.org/10.1109/iitc.2005.1499955 -
7
المؤلفون: K.-W. Lee, Kang-Wook Park, Won Ji Park, Young-Jin Wee, S. W. Nam, H. K. Kang, Kang-Deog Suh, Young-Joon Moon, I.G. Kim, Jae-Chul Kim, Seungmoo Lee, Hyun-Eok Shin, J.W. Hwang
المصدر: Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).
مصطلحات موضوعية: Materials science, business.industry, Copper interconnect, Oxide, Polishing, Dielectric, chemistry.chemical_compound, chemistry, Etching (microfabrication), Silicon carbide, Electronic engineering, Optoelectronics, Node (circuits), business, Lithography
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::85f86d9fa2649cfe83611dd9446da0c3
https://doi.org/10.1109/iitc.2004.1345683 -
8
المؤلفون: J.-H. Chung, I.-R. Kim, Jeong-Hoon Ahn, K.-P. Suh, K.-T. Lee, Sun-jung Lee, J.-S. Chung, Ho-Kyu Kang, Bong-seok Suh, S.-R. Hah, Young-Jin Wee, Won-sang Song, Seung-Man Choi, Kyu-Charn Park
المصدر: Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695).
مصطلحات موضوعية: Permittivity, Materials science, Annealing (metallurgy), business.industry, Sputtering, Physical vapor deposition, Contact resistance, Trench, Electronic engineering, Optoelectronics, Dielectric, Chemical vapor deposition, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ca9b37b4b9e6d2287c305e5d852a9f14
https://doi.org/10.1109/iitc.2003.1219743 -
9
المؤلفون: Sang Rok Hah, Ja Eung Ku, Soo Geun Lee, Won Sang Song, Joo Hyuk Chung, Ho-Kyu Kang, Young Jin Wee, Hong Jae Shin, Kyoung-Woo Lee, Seung-Jin Lee, Gwang Pyuk Suh, Jae Hak Kim, Nam Hyung Lee, Ki-Kwan Park
المصدر: IEEE International Electron Devices Meeting 2003.
مصطلحات موضوعية: Materials science, Moisture, Diffusion barrier, business.industry, chemistry.chemical_element, Dielectric, Dielectric thin films, Copper, Electromigration, Reliability (semiconductor), chemistry, Electronic engineering, Optoelectronics, Re engineering, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::62ee8fcc4f0baee19ad0f5c1abcdc81b
https://doi.org/10.1109/iedm.2003.1269338 -
10
المؤلفون: A.T. Kim, Hong-jae Shin, M.Y. Kim, H. K. Kang, S.W. Nam, Y.J. Moon, Suk-Joo Lee, Tae-Kyung Kim, S.M. Choi, Young-Jin Wee, I.R. Kim, J.W. Hwang, B.S. Suh, J.E. Ku, Jae-Duk Lee, Won Ho Choi, G.P. Suh, K. W. Lee, Jung-hyeon Kim, Hyeon-deok Lee, I.H. Oh, A.M. Lee, Nae-In Lee, K.-K. Park, Soon-yeon Park, J.Y. Maeng
المصدر: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..
مصطلحات موضوعية: Interconnection, Compressive strength, Materials science, chemistry, Residual stress, Mechanical strength, chemistry.chemical_element, Dielectric, Composite material, Layer (electronics), Copper, Electromigration
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::17e857fa1202c6ab089b66acb91a486b
https://doi.org/10.1109/iedm.2004.1419343
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