المؤلفون: Chul-Won Ju, Seong-Jin Kim, Kyu-Ha Pack, Hee-Tae Lee, Young-Chul Hyun, Seong-Su Park

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1178-1181 2002

Relation: Proceedings of 52nd Electronic Components and Technology Conference

المؤلفون: Seong-Su Park, Young-Chul Hyun, Kyu-Ha Pack, Hee-Tae Lee, Chul-Won Ju, Seong-Jin Kim

المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

مصطلحات موضوعية: Reflow soldering, Materials science, Resist, Soldering, Electronic packaging, Electronic engineering, Wafer, Composite material, Electroplating, Wafer-level packaging, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::94344f3ff2ae558cb2ca07415335284e
https://doi.org/10.1109/ectc.2002.1008255