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1مؤتمر
المؤلفون: Chul-Won Ju, Seong-Jin Kim, Kyu-Ha Pack, Hee-Tae Lee, Young-Chul Hyun, Seong-Su Park
المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Electronic components and technology conference Electronic Components and Technology Conference, 2002. Proceedings. 52nd. :1178-1181 2002
Relation: Proceedings of 52nd Electronic Components and Technology Conference
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المؤلفون: Seong-Su Park, Young-Chul Hyun, Kyu-Ha Pack, Hee-Tae Lee, Chul-Won Ju, Seong-Jin Kim
المصدر: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
مصطلحات موضوعية: Reflow soldering, Materials science, Resist, Soldering, Electronic packaging, Electronic engineering, Wafer, Composite material, Electroplating, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::94344f3ff2ae558cb2ca07415335284e
https://doi.org/10.1109/ectc.2002.1008255