المؤلفون: Young-Ki Ko, Hyun-Gyu Kim, Jong-Wook Lee, Young-Ro Kim, Hyeong-Cheol Oh, Sung-Jea Ko

المصدر: Proceedings of IEEE. IEEE Region 10 Conference. TENCON 99. 'Multimedia Technology for Asia-Pacific Information Infrastructure' (Cat. No.99CH37030) TENCON 1999 TENCON 99. Proceedings of the IEEE Region 10 Conference. 2:848-851 vol.2 1999

Relation: Proceedings of IEEE. IEEE Region 10 Conference. TENCON 99. 'Multimedia Technology for Asia-Pacific Information Infrastructure'

المؤلفون: Young-Ki Ko, June-Sok Lee, You-Young Jung, Byung-Soo Kim, Sung-Jea Ko

المصدر: ICCE. International Conference on Consumer Electronics (IEEE Cat. No.01CH37182) Consumer electronics Consumer Electronics, 2001. ICCE. International Conference on. :210-211 2001

Relation: ICCE. International Conference on Consumer Electronics

المؤلفون: Young-Ro Kim, Chin-Youl Kim, Young-Ki Ko, Sung-Jea Ko

المصدر: 1999 Digest of Technical Papers. International Conference on Consumer Electronics (Cat. No.99CH36277) Consumer electronics Consumer Electronics, 1999. ICCE. International Conference on. :236-237 1999

Relation: 1999 Digest of Technical Papers. International Conference on Consumer Electronics

المؤلفون: Yong-Ho Ko, Chang-Woo Lee, Young-Ki Ko

المصدر: Journal of the Korean Society for Precision Engineering. 31:865-871

مصطلحات موضوعية: Thermal copper pillar bump, Bridging (networking), Materials science, business.industry, Mechanical Engineering, Electronic packaging, Chip stacking, Chip, Industrial and Manufacturing Engineering, Soldering, Electronic engineering, Optoelectronics, Wafer, Safety, Risk, Reliability and Quality, business, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7504b0448b5ebf14f927641b48818d85
https://doi.org/10.7736/kspe.2014.31.10.865

المؤلفون: Junghwan Bang, Chang-Woo Lee, Yong-Ho Ko, Young-Ki Ko

المصدر: Journal of Welding and Joining. 32:68-73

مصطلحات موضوعية: Materials science, Metallurgy, Molten metal, Composite solder, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c0e08cf27454207096195ace17ee3cd2
https://doi.org/10.5781/jwj.2014.32.3.68

المؤلفون: Junghwan Bang, Young-Ki Ko, Chang-Woo Lee, Yong-Ho Ko

المصدر: Journal of Welding and Joining. 32:19-26

مصطلحات موضوعية: Wire bonding, Interconnection, Materials science, Through-silicon via, business.industry, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, Engineering physics, Reliability (semiconductor), Soldering, Hardware_INTEGRATEDCIRCUITS, Miniaturization, Wafer, Electronics, Hardware_ARITHMETICANDLOGICSTRUCTURES, business

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::53b503a6ede97e065aba27e939b9cdb7
https://doi.org/10.5781/jwj.2014.32.3.19

المؤلفون: Jung Hwan Bang, Chang-Woo Lee, Young Ki Ko, Yong-Ho Ko

المصدر: Materials Science Forum. :2758-2764

مصطلحات موضوعية: Materials science, Through-silicon via, Mechanical Engineering, Electronic packaging, Nanoparticle, Condensed Matter Physics, Reliability (semiconductor), Electrical resistance and conductance, Mechanics of Materials, Soldering, General Materials Science, Electronics, Composite material, Electroplating

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3b033b2e1e056a94b874be7bd7feacc7
https://doi.org/10.4028/www.scientific.net/msf.783-786.2758

المؤلفون: Chang-Woo Lee, Sang-Hyun Kwon, Jun-Ki Kim, Young-Kyu Lee, Sehoon Yoo, Young-Ki Ko

المصدر: Journal of Alloys and Compounds. 583:155-161

مصطلحات موضوعية: Fabrication, Materials science, Mechanical Engineering, Composite number, Metals and Alloys, Intermetallic, Carbon nanotube, Solder ball, law.invention, Mechanics of Materials, law, Soldering, Materials Chemistry, Ball (bearing), Composite material, Ball mill

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::14c44775d267b50d093e27a3dba7d8ec
https://doi.org/10.1016/j.jallcom.2013.08.052

المؤلفون: Chang-Woo Lee, Young-Ki Ko, Jong-Myeong Park, Young-Bae Park, Byeong-Rok Lee

المصدر: Journal of the Microelectronics and Packaging Society. 20:45-51

مصطلحات موضوعية: In situ, Materials science, Soldering, Metallurgy, Intermetallic, Activation energy

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::11d7595949815fba65f064ef0803aca5
https://doi.org/10.6117/kmeps.2013.20.3.045

المؤلفون: Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee, Young-Ki Ko

المصدر: Journal of Welding and Joining. 30:21-25

مصطلحات موضوعية: Materials science, Fabrication, Soldering, Metallurgy, Composite solder, Composite material

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::304e79a8ce3a135572659117e2accf18
https://doi.org/10.5781/kwjs.2012.30.3.219