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المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 20(2):358-365 Jun, 2020

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المصدر: In International Journal of Heat and Mass Transfer September 2019 140:88-99

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المصدر: Third International Conference on Natural Computation (ICNC 2007) Natural Computation, 2007. ICNC 2007. Third International Conference on. 2:253-257 Aug, 2007

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Relation: Digests of INTERMAG 2003. International Magnetics Conference

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المؤلفون: Yang, G.F., Xie, F., Tong, Y.Y., Chen, P., Yu, Z.G., Yan, D.W., Xue, J.J., Zhu, H.X., Guo, Y., Li, G.H., Gao, S.M.

المصدر: In Materials Science in Semiconductor Processing February 2015 30:694-706