يعرض 1 - 10 نتائج من 482 نتيجة بحث عن '"Yuile A"', وقت الاستعلام: 1.31s تنقيح النتائج
  1. 1
    مؤتمر
    Study of Thermal Loading of Ceramic Capacitors during Reflow Soldering

    المؤلفون: Yuile, Adam, Wiss, Erik, Barth, David, Wiese, Steffen

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-5 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  2. 2
    مؤتمر
    Thermal Assessment of Soldering MLCC Components

    المؤلفون: Wiss, Erik, Yuile, Adam, Barth, David, Wiese, Steffen

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    دورية أكاديمية
    LTCC With Temperature Sensor Array for Monitoring of Reactive Die Bond Processes–Design Optimization Using CFD

    المؤلفون: Yuile, A., Wiese, S.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(1):122-129 Jan, 2024

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  4. 4
    مؤتمر
    Application of Reactive Bonding Methods on LTCC Substrates

    المؤلفون: Wiss, Erik, Schulz, Alexander, Yuile, Adam, Maeller, J ens, Wiese, Steffen

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-6 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  5. 5
    مؤتمر
    Reactive Die Bonding on LTCC Substrates – Analysis by CFD Simulation

    المؤلفون: Wiss, Erik, Yuile, Adam, Schulz, Alexander, Muller, Jens, Wiese, Steffen

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  6. 6
    مؤتمر
    CFD Simulations of Reactive Multi-Layer Usage in Joining Processes

    المؤلفون: Yuile, A., Wiese, S.

    المصدر: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-5 Jul, 2020

    Relation: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  7. 7
    مؤتمر
    Temperature evaluation of solder joints for adjusting reflow profiles

    المؤلفون: Wiese, S., Mueller, M., Cap, D., Barth, D., Yuile, A., Schindler, S., Panchenko, I.

    المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-7 Sep, 2019

    Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  8. 8
    مؤتمر
    Simulation of temperature profiles in reflow ovens for soldering area array components

    المؤلفون: Yuile, A., Wiese, S.

    المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-5 Sep, 2019

    Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  9. 9
    دورية أكاديمية
    Volumetric response and pattern of failure of histone altered high grade glioma in adults following management with radiation therapy

    المؤلفون: Knight, A.Aff1, Aff6, IDs11060023043324_cor1, Horsley, P., Yuile, A.Aff1, Aff2, Aff5, Aff6, Yim, J.Aff1, Aff3, Aff5, Suh, M., Venketesha, V.Aff1, Aff7, Kastelan, M.Aff1, Aff5, Wheeler, H.Aff1, Aff5, Aff6, Back, M.Aff1, Aff2, Aff4, Aff5, Aff6

    المصدر: Journal of Neuro-Oncology. :1-8

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  10. 10
    دورية أكاديمية
    Simulation of Mechanical Stresses in BaTiO3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models

    المؤلفون: Adam Yuile, Erik Wiss, David Barth, Steffen Wiese

    المصدر: Materials, Vol 17, Iss 11, p 2702 (2024)

    مصطلحات موضوعية: MLCC, BaTiO3, reflow, desoldering, hot air rework, CFD, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

    وصف الملف: electronic resource

    Relation: https://www.mdpi.com/1996-1944/17/11/2702; https://doaj.org/toc/1996-1944

    URL الوصول: https://doaj.org/article/b74dda91159a47e1a470f303442f6970

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