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1مؤتمر
المؤلفون: Garner, Luke, Raghavan, Prasanna, Noolu, Naren, Sanchez, Jorge, Yung Hsiang Lee
المصدر: 2008 58th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2008. ECTC 2008. 58th. :406-411 May, 2008
Relation: 2008 58th Electronic Components and Technology Conference (ECTC 2008)
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2
المؤلفون: Yi-Jia Lin, Tzyy-Yuang Shiang, Tsung-Han Liu, Yung-Hsiang Lee, Shih-Chi Lee, Wei-Chun Hsu, Chao-Chin Chang
المصدر: Sports biomechanics.
مصطلحات موضوعية: Physical Therapy, Sports Therapy and Rehabilitation, Orthopedics and Sports Medicine
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3
المؤلفون: Yung-Hsiang Lee, Li-Fong Lin, Chao-Chin Chang, Zhong-Rong Hsieh, Yi-Jia Lin, Chih-Yi Tsai, Wei-Chun Hsu, Jia-Lin Wu, Tommy Sugiarto
المصدر: IEEE Consumer Electronics Magazine. 9:54-60
مصطلحات موضوعية: 030506 rehabilitation, medicine.medical_specialty, medicine.diagnostic_test, Vastus medialis, business.industry, 030229 sport sciences, Electromyography, Knee Joint, Brace, Computer Science Applications, Human-Computer Interaction, Vibration, 03 medical and health sciences, 0302 clinical medicine, Physical medicine and rehabilitation, Hardware and Architecture, Medicine, Electrical and Electronic Engineering, Muscle activity, 0305 other medical science, business
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4دورية أكاديمية
المؤلفون: Yu-Hsin Cheng, Yung-Hsiang Lee, Chung-Ru Ho, Nan-Jung Kuo, Feng-Chun Su
المصدر: Sensors, Vol 11, Iss 8, Pp 7530-7544 (2011)
مصطلحات موضوعية: infrared sensor, data mining, neural network, sea surface temperature, tropical pacific, Chemical technology, TP1-1185
وصف الملف: electronic resource
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5دورية أكاديمية
المؤلفون: Yung-Hsiang Lee, Nan-Jung Kuo, Chung-Ru Ho, Zhe-Wen Zheng, Yu-Hsin Cheng
المصدر: Sensors, Vol 9, Iss 7, Pp 5521-5533 (2009)
مصطلحات موضوعية: multi-sensors, integration filtering algorithm, cold dome, Kuroshio, Chemical technology, TP1-1185
وصف الملف: electronic resource
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6
المؤلفون: Yung Hsiang Lee, Ian Chin, Wei Keat Loh
المصدر: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).
مصطلحات موضوعية: 010302 applied physics, Absorption (acoustics), Materials science, Moisture, Delamination, Electronic packaging, Mechanical engineering, Humidity, 02 engineering and technology, 021001 nanoscience & nanotechnology, 01 natural sciences, Corrosion, Reliability (semiconductor), 0103 physical sciences, 0210 nano-technology, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::349be87cd86726d78bb61b3e4bc8276f
https://doi.org/10.1109/iemt.2018.8511674 -
7
المؤلفون: Chun-Yi Lin, Shin-Jye Liang, Chung-Ru Ho, Nan-Jung Kuo, Yung-Hsiang Lee
المصدر: Global and Planetary Change. 100:234-244
مصطلحات موضوعية: Global and Planetary Change, Indian ocean, Climatology, Anomaly (natural sciences), Thermal, Climate shift, Environmental science, Magnitude (mathematics), Oceanography, Thermal energy storage, Indo-Pacific, Pacific decadal oscillation
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8
المؤلفون: Quanan Zheng, Chung-Ru Ho, Ruo Shan Tseng, Yung-Hsiang Lee, Feng-Chun Su
المصدر: IEEE Geoscience and Remote Sensing Letters. 7:718-722
مصطلحات موضوعية: Sea surface temperature, Water mass, Artificial neural network, Meteorology, Ocean color, Climatology, Front (oceanography), Radiometry, Moderate-resolution imaging spectroradiometer, Electrical and Electronic Engineering, Geotechnical Engineering and Engineering Geology, Spatial distribution, Geology
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9
المؤلفون: Kang Eu Ong, Paramjeet S Gill, Yung Hsiang Lee, Shaw Fong Wong, Kah Kee Tan, Wei Keat Loh
المصدر: 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
مصطلحات موضوعية: Surface-mount technology, Reflow soldering, Reliability (semiconductor), Materials science, JEDEC memory standards, Ball grid array, Soldering, Electronic engineering, Mechanical engineering, Coplanarity, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b367257cdc2b35b903006398a36fd19d
https://doi.org/10.1109/iemt.2010.5746680 -
10
المؤلفون: Yung Hsiang Lee, J. Sanchez, Prasanna Raghavan, N. Noolu, L. Gamer
المصدر: 2008 58th Electronic Components and Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Engineering drawing, Engineering, Packaging engineering, business.industry, Soldering, Condition monitoring, Coplanarity, Integrated circuit packaging, business, Grid, Temperature measurement, Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9c5cd16841ca3d1695f83c63e00d5730
https://doi.org/10.1109/ectc.2008.4550003