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المؤلفون: Yung-Yi Yeh, Jen-Chieh Kao, Chang-Lin Yeh, Chang-Chi Lee, Ho-Ming Tong, Tong Hong Wang
المصدر: 2013 IEEE 63rd Electronic Components and Technology Conference.
مصطلحات موضوعية: Materials science, business.product_category, business.industry, Three-dimensional integrated circuit, Coplanarity, Structural engineering, Flattening, Flexural strength, Spring (device), Soldering, Die (manufacturing), Deformation (engineering), Composite material, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c5aa62c60a39ac94faa1aef90e9753cb
https://doi.org/10.1109/ectc.2013.6575680