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1
المصدر: Journal of Cellular Physiology. 230:1944-1953
مصطلحات موضوعية: medicine.medical_specialty, Bone density, Physiology, business.industry, Clinical Biochemistry, Osteoporosis, Diphosphonates, Osteoblast, Cell Biology, medicine.disease, Bone resorption, Bone Density Conservation Agents, Endocrinology, medicine.anatomical_structure, Osteoclast, Internal medicine, Diabetes mellitus, medicine, business
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2
المؤلفون: Fu Guo, Limin Ma, Yong Zuo, Yutian Shu
المصدر: Journal of Materials Research. 29:2738-2747
مصطلحات موضوعية: Dislocation creep, Materials science, Mechanical Engineering, Metallurgy, Condensed Matter Physics, Electromigration, Simple shear, Lap joint, Creep, Mechanics of Materials, Soldering, General Materials Science, Composite material, Joint (geology), Current density
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3
المؤلفون: Yutian Shu, Junchao Wang, Zeljko Zilic
المصدر: BSN
مصطلحات موضوعية: Computer science, 010401 analytical chemistry, Non invasive, Wearable computer, 020206 networking & telecommunications, 02 engineering and technology, Body water loss, 01 natural sciences, 0104 chemical sciences, Signal strength, Linear regression, 0202 electrical engineering, electronic engineering, information engineering, Biomedical engineering, Hydration status
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a3225d4f69d36662af6594fae3fee892
https://doi.org/10.1109/bsn.2017.7936015 -
4
المؤلفون: Yong Zuo, Fu Guo, K. N. Subramanian, Yutian Shu, Andree Lee, Lei Qiao, Limin Ma
المصدر: Journal of Electronic Materials. 43:4395-4405
مصطلحات موضوعية: Materials science, Condensed Matter Physics, Microstructure, Electromigration, Electronic, Optical and Magnetic Materials, Cracking, Creep, Soldering, Materials Chemistry, Fracture (geology), Electrical and Electronic Engineering, Composite material, Current density, Joint (geology)
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5
المؤلفون: Limin Ma, Fu Guo, Yutian Shu, Yong Zuo, Sihan Liu
المصدر: Journal of Electronic Materials. 44:597-603
مصطلحات موضوعية: Materials science, Metallurgy, Temperature cycling, Condensed Matter Physics, Microstructure, Electromigration, Electronic, Optical and Magnetic Materials, Soldering, Materials Chemistry, Coupling (piping), Electrical and Electronic Engineering, Joule heating, Current density, Eutectic system
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6
المؤلفون: Fu Guo, K. N. Subramanian, Sihan Liu, Yutian Shu, Limin Ma, Andre Lee
المصدر: Journal of Electronic Materials. 43:26-32
مصطلحات موضوعية: Materials science, Scanning electron microscope, Whiskers, Metallurgy, Intermetallic, Condensed Matter Physics, Electromigration, Electronic, Optical and Magnetic Materials, Silanol, chemistry.chemical_compound, chemistry, Whisker, Soldering, Materials Chemistry, Electrical and Electronic Engineering, Composite material, Eutectic system
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7
المؤلفون: Yutian Shu, Eldon D. Case, Melissa J. Baumann
المصدر: Journal of Materials Science. 47:6542-6552
مصطلحات موضوعية: Materials science, Mechanical Engineering, Crack growth resistance curve, Slow growth, Ambient air, Crack closure, Brittleness, Mechanics of Materials, Residual stress, Indentation, Solid mechanics, Forensic engineering, General Materials Science, Composite material
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8
المؤلفون: Melissa J. Baumann, Yutian Shu, Fei Ren, Eldon D. Case, Xiaofeng Fan
المصدر: Journal of the Mechanical Behavior of Biomedical Materials. 8:99-110
مصطلحات موضوعية: Materials science, Weibull modulus, Biomedical Engineering, Modulus, Young's modulus, Biomaterials, symbols.namesake, Durapatite, Brittleness, Flexural strength, Mechanics of Materials, Elastic Modulus, Tensile Strength, Materials Testing, symbols, Composite material, Porosity, Elastic modulus, Yttria-stabilized zirconia
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المؤلفون: Lindsay M, Coe, Srinivasan Arjun, Tekalur, Yutian, Shu, Melissa J, Baumann, Laura R, McCabe
المصدر: Journal of cellular physiology. 230(8)
مصطلحات موضوعية: Male, Osteoblasts, Alendronate, Bone Density Conservation Agents, Diphosphonates, X-Ray Microtomography, Article, Diabetes Mellitus, Experimental, Mice, Inbred C57BL, Mice, Diabetes Mellitus, Type 1, Bone Density, Osteogenesis, In Situ Nick-End Labeling, Animals, Bone Resorption
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المصدر: 2014 15th International Conference on Electronic Packaging Technology.
مصطلحات موضوعية: Materials science, Creep, Soldering, Metallurgy, Deformation (engineering), Microstructure, Joint (geology), Electromigration, Current density, Grain size
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::e81490c9c37baca9632f967c2ac6eaf7
https://doi.org/10.1109/icept.2014.6922793