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المؤلفون: E.A. Alkhazraji, Wenna Du, Jiaorong Fan, M.Z.M. Khan, M.T.A. Khan, Ziling Li, Xiaohang Li, Di Li, Che-Hao Liao, Huiyun Liu, Xinfeng Liu, Y.J. Lu, Yang Mi, T.K. Ng, B.S. Ooi, Songnan Qu, C.X. Shan, D.Z. Shen, Z.F. Shi, Haiding Sun, Mingchu Tang, Zhen Tian, Jiang Wu, Yu Ye, Ding Zhou
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::95bf4b1b0dbde00a9ebd14d16ee65785
https://doi.org/10.1016/b978-0-12-814162-5.01002-5 -
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المؤلفون: X.X. Hu, G.Q. Huang, Z.F. Shi, Y.J. Zhang, S.F. Jiao, X.T. Liang, Y.Z. Yin, X. Gan
المصدر: Asian Journal of Chemistry. 27:1671-1674
مصطلحات موضوعية: Solvent, chemistry.chemical_classification, chemistry.chemical_compound, 4-nitrobenzenethiol, chemistry, Cumene hydroperoxide, Glutathione peroxidase, Organic chemistry, General Chemistry, Catalysis
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::85b0b65b4112a69ca98927e604279fae
https://doi.org/10.14233/ajchem.2015.17469 -
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المصدر: Asian Journal of Chemistry. 26:2311-2314
مصطلحات موضوعية: General Chemistry
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2b2aa2df55e25e731cbcd4b9c74b4ba4
https://doi.org/10.14233/ajchem.2014.15802 -
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المؤلفون: K. M. Chua, Stephen C. K. Wong, Y.M. Tan, Peter Z.F. Shi
المصدر: Journal of Physics: Conference Series. 34:142-147
مصطلحات موضوعية: History, Heat pipe, Materials science, Heat transfer, Thermal, Micro-loop heat pipe, Mechanical engineering, Groove (music), Computer Science Applications, Education
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المؤلفون: Albert C. W. Lu, Ronson Tan, Stephen C. K. Wong, Peter Z.F. Shi, Y.M. Tan, Eric Tan
المصدر: Microelectronics Reliability. 44:755-769
مصطلحات موضوعية: Engineering, Natural convection, business.industry, Airflow, Mechanical engineering, Computational fluid dynamics, Heat sink, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials, Modeling and simulation, Thermal, Heat spreader, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, business, Wind tunnel
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المؤلفون: T.C. Au-Yeung, Chan Hin Kam, Z.F. Shi, Rajesh Menon
المصدر: Physics Letters A. 250:185-190
مصطلحات موضوعية: Physics, Hydrogen, chemistry, Quantum mechanics, Bound state, General Physics and Astronomy, chemistry.chemical_element, Condensed Matter::Mesoscopic Systems and Quantum Hall Effect, Wave function, Quantum, Energy (signal processing)
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المؤلفون: M. Rajesh, T.C. Au-Yeung, Chan Hin Kam, R.A. Straughan, Z.F. Shi
المصدر: Physics Letters A. 238:66-72
مصطلحات موضوعية: Physics, Coupling constant, Condensed matter physics, Cyclotron, General Physics and Astronomy, Condensed Matter::Mesoscopic Systems and Quantum Hall Effect, law.invention, Rydberg constant, law, Impurity, Excited state, Atomic physics, Ground state, Quantum, Energy (signal processing)
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8
المؤلفون: B. Lim, M. Ying, Peter Z.F. Shi, S. M. L. Nai, J. Wei, C. K. Cheng
المصدر: Volume 4: Electronics and Photonics.
مصطلحات موضوعية: Thermal contact conductance, Engineering, business.industry, Electrical engineering, Heat sink, Thermal management of high-power LEDs, Automotive engineering, law.invention, LED lamp, Color rendering index, Reliability (semiconductor), Thermocouple, law, business, Light-emitting diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b00356f0b30da8be7927f09efa2bc783
https://doi.org/10.1115/imece2010-38557 -
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المؤلفون: A.C.W. Lu, P. Arulvanan, Peter Z.F. Shi
المصدر: 2007 9th Electronics Packaging Technology Conference.
مصطلحات موضوعية: Materials science, business.industry, Thermal resistance, Electrical engineering, law.invention, Power (physics), LED lamp, Thermal conductivity, Reliability (semiconductor), Heat flux, law, Electronic engineering, business, Power density, Light-emitting diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::77b28c52dc5547cee32054c871951f44
https://doi.org/10.1109/eptc.2007.4469728 -
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المؤلفون: Wei Fan, Peter Z.F. Shi, K.M. Chua, C.K. Wong, Y.M. Tan
المصدر: 2005 7th Electronic Packaging Technology Conference.
مصطلحات موضوعية: Thermoelectric cooling, Materials science, law, TEC, Thermoelectric effect, Miniaturization, Power cycling, Mechanical engineering, Wafer dicing, Heat pump, law.invention, Diode
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d26f1b34b98adf1786c4e7264842d8b3
https://doi.org/10.1109/eptc.2005.1614508