يعرض 1 - 10 نتائج من 235 نتيجة بحث عن '"Zahedmanesh, A."', وقت الاستعلام: 1.10s تنقيح النتائج
  1. 1
    مؤتمر
    De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure

    المؤلفون: Pedreira, O. Varela, Ding, Y., Coenen, D., Roussel, Ph., Saleh, A., Simons, V., Zahedmanesh, H., Ciofi, I., Croes, K.

    المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-5 Apr, 2024

    Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

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  2. 2
    مؤتمر
    Ruthenium Metallization and Via Prefill for Electromigration Reliability Enhancement in Advanced Sub-3 nm Node Interconnects

    المؤلفون: Esposto, Simone, Sisto, Giuliano, Ciofi, Ivan, Milojevic, Dragomir, Croes, Kristof, Zahedmanesh, Houman

    المصدر: 2023 IEEE International Integrated Reliability Workshop (IIRW) Integrated Reliability Workshop (IIRW), 2023 IEEE International. :1-4 Oct, 2023

    Relation: 2023 IEEE International Integrated Reliability Workshop (IIRW)

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  3. 3
    مؤتمر
    A pragmatic network-aware paradigm for system-level electromigration predictions at scale

    المؤلفون: Zahedmanesh, Houman, Roussel, Philippe, Ciofi, Ivan, Croes, Kristof

    المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-6 Mar, 2023

    Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

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  4. 4
    مؤتمر
    Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

    المؤلفون: Ding, Y., Pedreira, O. Varela, Lofrano, M., Zahedmanesh, H., Chavez, T., Farr, H., De Wolf, I., Croes, K.

    المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-7 Mar, 2023

    Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

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  5. 5
    مؤتمر
    Impact of via geometry and line extension on via-electromigration in nano-interconnects

    المؤلفون: Saleh, A. S., Zahedmanesh, H., Ceric, H., De Wolf, I., Croes, K.

    المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-4 Mar, 2023

    Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

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  6. 6
    دورية أكاديمية
    Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM

    المؤلفون: Mayahinia, M., Tahoori, M., Komalan, M.P., Zahedmanesh, H., Croes, K., Marinelli, T., Perez, J.I.G., Evenblij, T., Kar, G.S., Catthoor, F.

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 41(12):5327-5332 Dec, 2022

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  7. 7
    مؤتمر
    System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents

    المؤلفون: Zahedmanesh, Houman, Ciofi, Ivan, Zografos, Odysseas, Croes, Kristof, Badaroglu, Mustafa

    المصدر: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :1-7 Mar, 2022

    Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)

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  8. 8
    دورية أكاديمية
    An Adaptable Correlated Control for Maintaining Voltage Quality in Low-Voltage Distribution Grids Containing PVs and PEVs

    المؤلفون: Zahedmanesh, A., Muttaqi, K.M., Sutanto, D.

    المصدر: IEEE Transactions on Industrial Informatics IEEE Trans. Ind. Inf. Industrial Informatics, IEEE Transactions on. 18(9):5804-5814 Sep, 2022

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  9. 9
    مؤتمر
    Dynamics of electromigration voids in Cu interconnects: investigation using a physics-based model augmented by neural networks

    المؤلفون: Saleh, A. S., Zahedmanesh, H., Ceric, H., Croes, K., De Wolf, I.

    المصدر: 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :25-27 Jun, 2022

    Relation: 2022 IEEE International Interconnect Technology Conference (IITC)

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  10. 10
    مؤتمر
    A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network

    المؤلفون: Zahedmanesh, Houman, Ciofi, Ivan, Zografos, Odysseas, Badaroglu, Mustafa, Croes, Kristof

    المصدر: 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) SLIP System Level Interconnect Prediction (SLIP), 2021 ACM/IEEE International Workshop on. :1-7 Nov, 2021

    Relation: 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP)

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