يعرض 1 - 7 نتائج من 7 نتيجة بحث عن '"Zawra, I."', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics

    المؤلفون: Zawra, I., Umunnakwe, C. B., Soestbergen, M. van, Rudnyi, E. B., Bechtold, T.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  2. 2
    مؤتمر
    Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment

    المؤلفون: Umunnakwe, C. B., Zawra, I., Rudnyi, E. B., Niessner, M., Bechtold, T.

    المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

    Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications

    المؤلفون: Umunnakwe, C. B., Zawra, I., Yuan, C., Rudnyi, E. B., Hohlfeld, D., Niessner, M., Bechtold, T.

    المصدر: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022 23rd International Conference on. :1-5 Apr, 2022

    Relation: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  4. 4
    دورية أكاديمية
    Compact modelling of a thermo-mechanical finite element model of a microelectronic package

    المؤلفون: Umunnakwe, C.B., Zawra, I., Niessner, M., Rudnyi, E.B., Hohlfeld, D., Bechtold, T.

    المصدر: In Microelectronics Reliability December 2023 151

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  5. 5
    مؤتمر

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  6. 6
    مؤتمر

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  7. 7
    كتاب

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