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المؤلفون: Masao Ishihara, Hiizu Ohtorii, Zenya Yasuda, Takeshi Nogami, Shuzo Sato, Yuji Segawa, Kaori Tai, Y. Ohoka, Shingo Takahashi, Hiroshi Horikoshi, Naoki Komai
المصدر: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).
مصطلحات موضوعية: Materials science, Diffusion barrier, Annealing (metallurgy), business.industry, Metallurgy, Tantalum, chemistry.chemical_element, Chemical vapor deposition, Sputter deposition, Corrosion, Galvanic corrosion, chemistry, Optoelectronics, Surface layer, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b9812236813cf8c3a506c61eb46dff3e
https://doi.org/10.1109/iitc.2002.1014931 -
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المؤلفون: Takeshi Nogami, Hiizu Ohtorii, Shingo Takahashi, Yuji Segawa, Zenya Yasuda, Masao Ishihara, Hiroshi Horikoshi, Kaori Tai, H. Yamada, Naoki Komai
المصدر: 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303).
مصطلحات موضوعية: Permittivity, Materials science, chemistry, Trench, Copper interconnect, Electronic engineering, Compatibility (geochemistry), chemistry.chemical_element, Polishing, Composite material, Porosity, Porous medium, Copper
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::4cd5f958aad2e4880383320306ab4f46
https://doi.org/10.1109/vlsit.2002.1015376 -
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المؤلفون: Shingo Takahashi, Masao Ishihara, Hiizu Ohtorii, Yuji Segawa, Kaori Tai, Shuzo Sato, Y. Ohoka, Hiroshi Horikoshi, Zenya Yasuda, A. Yoshio, Naoki Komai, Takeshi Nogami
المصدر: International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).
مصطلحات موضوعية: Materials science, chemistry, Chemical-mechanical planarization, Metallurgy, Copper plating, Copper interconnect, Polishing, chemistry.chemical_element, Dielectric, Dielectric thin films, Electrochemical dissolution, Copper
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1607e8cdef3042d9bac693e9bdd2ab2e
https://doi.org/10.1109/iedm.2001.979413