يعرض 1 - 10 نتائج من 86,201 نتيجة بحث عن '"Zhang, Jing"', وقت الاستعلام: 1.74s تنقيح النتائج
  1. 1
    مؤتمر
    Optimal Timeslot Assignment in a Fully-connected Unmanned Aerial Vehicles Network

    المؤلفون: Zhang, Jing, Huang, Zixuan, Sun, Bingyu

    المصدر: 2024 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2024 IEEE/CIC International Conference on. :161-166 Aug, 2024

    Relation: 2024 IEEE/CIC International Conference on Communications in China (ICCC)

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  2. 2
    مؤتمر
    Joint Beamforming for RIS-Assisted Hybrid MIMO Systems Based on Model-Driven Deep Learning

    المؤلفون: Hu, Peiqi, Zhang, Jing, Jin, Weijie, Wen, Chao-Kai, Jin, Shi

    المصدر: 2024 IEEE/CIC International Conference on Communications in China (ICCC) Communications in China (ICCC), 2024 IEEE/CIC International Conference on. :1205-1210 Aug, 2024

    Relation: 2024 IEEE/CIC International Conference on Communications in China (ICCC)

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  3. 3
    مؤتمر
    The bonding mechanisms and reliability of pressure-assisted Cu sintering on Cu/Ag metal surfaces

    المؤلفون: Yang, Jiyi, Gao, Yue, Xin, Jianbo, Liu, Yang, Zhang, Jing

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    In-Situ Reduction Sintering of Micro-Copper Paste for High-Power Electronic Application

    المؤلفون: Xiao, Nan, Liu, Yang, Li, Ke, Zhang, Jing

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    An SEM-Based Finite Element Analysis of Cu-Ag Sintered Joints on Thermal Shock Reliability

    المؤلفون: Wang, Xinyue, Yang, Zhoudong, Ji, Liangzheng, Zeng, Zejun, Chen, Haixue, Fan, Jiajie, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Numerical Modeling and Validation of Silicone-Type Receiving Layer for Micro-LED Laser-Based Mass Transfer

    المؤلفون: Li, Zehou, Ji, Liangzheng, Wang, Xin, Li, Zaihuan, Liu, Yang, Zhang, Jing

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Revolutionizing Power Module Manufacturing: Large Area Sintering with Silver Pastes for Enhanced Performance and Cost-Effectiveness

    المؤلفون: Wang, Jianhao, Gao, Yue, He, Yiting, Liu, Wenting, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Non-Pressure Cu Sinter Paste for High Density Power Device Interconnection

    المؤلفون: Gao, Yue, Wang, Jianhao, He, Yiting, Liu, Wenting, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    An Investigation of Process Parameters Effects on Void Formation in Fluxless Solder Paste for Power Module Packaging Applications via Formic Acid Vacuum Reflow Technology

    المؤلفون: Ji, Liangzheng, Guo, Wenwu, Zhang, Guoqi, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging

    المؤلفون: Liu, Wenting, Wang, Jianhao, Gao, Yue, Ji, Liangzheng, Zhang, Jing, Zhang, Guoqi, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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