يعرض 1 - 10 نتائج من 397 نتيجة بحث عن '"Zhang, Xin Ping"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

    المؤلفون: Lyu, Guang-Chao, Chen, Bin, Zhang, Xin-Ping, Zhou, Min-Bo, Ke, Chang-Bo, Mai, Yiu-Wing

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :647-654 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    A combined simulation and experimental study on cracking and delamination behavior at the Cu/Polyimide interface of RDLs in chiplet package subjected to thermo-mechanical loads

    المؤلفون: Chen, Bin, Lyu, Guang-Chao, Wang, Hong-Guang, Zheng, Long, Deng, Yun-Kai, Zhang, Xin-Ping

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2046-2053 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    An Intensive Study of Effects of Orientations of Cu Bumps on Cu-Cu Direct Bonding for 3D Integration by Molecular Dynamics Simulation

    المؤلفون: Zheng, Deng-Wu, Zhou, Min-Bo, Liu, Shuai, Ke, Chang-Bo, Zhang, Xin-Ping

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1760-1766 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Atomic-scale study of Cu–Cu direct bonding with assistance of Cu nanoparticles as joining medium by molecular dynamics simulation

    المؤلفون: Zheng, Deng-Wu, Zhou, Min-Bo, Liu, Shuai, Ke, Chang-Bo, Zhang, Xin-Ping

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Interfacial Delamination Characterization and Thermo-mechanical Reliability of Stacked Die Package by Finite Element Analysis

    المؤلفون: Chen, Bin, Wang, Hong-Guang, Lyu, Guang-Chao, Yang, Bing-Xian, Hu, Wei-Lin, Zhang, Xin-Ping

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Moisture Desorption and Hygro-Vapor-Thermal Induced Interfacial Delamination in Underfilled FCBGA Package During Reflow Process

    المؤلفون: Zheng, Long, Deng, Yun-Kai, Wang, Hong-Guang, Lyu, Guang-Chao, Yang, Bing-Xian, Hu, Wei-Lin, Zhang, Xin-Ping

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Large-area Die Attachment and the Surface Finish Effect on Bonding Strength of Joints in High-power Electronics Using a Low-temperature Sinterable Cu Nanoparticle Paste

    المؤلفون: Wang, Chun-Meng, Hou, Bin, Deng, Yun-Kai, Zhou, Min-Bo, Zhang, Xin-Ping

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique

    المؤلفون: Lyu, Guang-Chao, Zhou, Min-Bo, Zhang, Xin-Ping

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Influences of Organic Acids in the Soldering Flux System on Wettability and Self-alignment Ability of Sn–3.0Ag–0.5Cu Solder Paste during Reflow Process

    المؤلفون: He, Huan, Fang, Shu, Qin, Jun-Hu, Wu, Xin, Zhang, Xin-Ping

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    A Comprehensive Study of Crack Initiation and Delamination Propagation at the Cu/Polyimide Interface in Fan-out Wafer Level Package during Reflow Process

    المؤلفون: Wang, Hong-Guang, Lyu, Guang-Chao, Deng, Yun-Kai, Hu, Wei-Lin, Yang, Bing-Xian, Zhou, Min-Bo, Zhang, Xin-Ping

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1459-1464 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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