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1مؤتمر
المؤلفون: Zhen-guo, Yang
المصدر: 2010 International Conference on Management Science & Engineering 17th Annual Conference Proceedings Management Science and Engineering (ICMSE), 2010 International Conference on. :1037-1042 Nov, 2010
Relation: 2010 International Conference on Management Science and Engineering (ICMSE)
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2دورية أكاديمية
المؤلفون: Chang Su, Tong-Tong Bi, Zhen-Guo Yang
المصدر: Materials, Vol 16, Iss 2, p 722 (2023)
مصطلحات موضوعية: polyurethane rubber, antenna baffle, environmental stress cracking, bubble, failure analysis, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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3دورية أكاديمية
المؤلفون: Ze-An Weng, Xiao-Xiong Huang, Die Deng, Zhen-Guo Yang, Shu-Yuan Li, Jian-Kun Zang, Yu-Feng Li, Yan-Fang Liu, You-Sheng Wu, Tian-Yuan Zhang, Xuan-Lin Su, Dan Lu, An-Ding Xu
المصدر: Frontiers in Neurology, Vol 13 (2022)
مصطلحات موضوعية: acute ischemic stroke, intravenous thrombolysis, intracranial hemorrhage, nomogram, predictive model, Neurology. Diseases of the nervous system, RC346-429
وصف الملف: electronic resource
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4دورية أكاديمية
المؤلفون: Guang-qing He, Zhen-guo Yang, Bin Xi, You-peng Zhang, Disi Wang, Bo Liu, Song Li
المصدر: Nuclear Materials and Energy, Vol 29, Iss , Pp 101090- (2021)
مصطلحات موضوعية: AP1000, Main pump casing, Welding deformation control, Nuclear engineering. Atomic power, TK9001-9401
وصف الملف: electronic resource
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5مؤتمر
المؤلفون: Xiao-Wei Tian, Zhen-Guo Yang, Jiang-yan Sun, Zheng Ji
المصدر: 2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-5 Jul, 2008
Relation: 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
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6مؤتمر
المؤلفون: Li-Na Ji, Zhen-Guo Yang
المصدر: 2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-6 Jul, 2008
Relation: 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
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7
المؤلفون: Mao-Kai Xu, Xiang Li, Cai-Ru Feng, Xue-Ling Li, Zhen-Guo Yang
المصدر: Journal of Failure Analysis and Prevention. 23:643-658
مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering, General Materials Science, Safety, Risk, Reliability and Quality
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8دورية أكاديمية
المؤلفون: Sheng-Hui Wang, Yi Gong, Qi Tong, Xiao-Lei Yang, Jia-Hao Shen, Zhen-Guo Yang
المصدر: Materials, Vol 14, Iss 15, p 4234 (2021)
مصطلحات موضوعية: safety design, failure analysis, extraction column, methyl methacrylate, finite element analysis, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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9
المؤلفون: Guang-Qing He, Xiao-Lei Yang, Yi Gong, Dong-Qing Lu, Jian-Guo Deng, Jia-Lei Gu, Qiong Wu, Zhen-Guo Yang
المصدر: Engineering Failure Analysis. 146:107062
مصطلحات موضوعية: General Engineering, General Materials Science
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10دورية أكاديمية
المؤلفون: Bo-Chao, Liu, Zhen-Guo, Yang
المصدر: Journal of Failure Analysis and Prevention. June 2016 16(3):337-345