المؤلفون: Fuping Zeng, Zhaofeng Wan, Zhicheng Lei, Ju Tang, Liangjun Dai, Xiaohua Wang, Qiang Yao

المصدر: IEEE Access, Vol 7, Pp 62080-62086 (2019)

مصطلحات موضوعية: Environmental friendly insulating medium, C₅F₁₀O, thermal stability, over thermal decomposition characteristics, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8708260/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/96349408d12d448db9d62c18a98e3247

المؤلفون: Zhicheng Lei, Fuping Zeng, Ju Tang, Zhaofeng Wan, Mingxuan Zhang, Liangjun Dai

المصدر: IEEE Access, Vol 7, Pp 92724-92731 (2019)

مصطلحات موضوعية: C5-PFK insulating gas, conformation analysis, stability, reactivity, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/8758804/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/bc2af999aacf4648b6da19cd4d011640

المؤلفون: Da, Zhou, Xin, Zhang, Kaiqiang, Xian, Yingxin, Gu, Jinqiu, Zhang, Xuancheng, Huang, Zhicheng, Lei

المصدر: 2022 China International Conference on Electricity Distribution (CICED) Electricity Distribution (CICED), 2022 China International Conference on. :238-242 Sep, 2022

Relation: 2022 China International Conference on Electricity Distribution (CICED)

المؤلفون: Zhicheng, Lei, Chao, Yuan, Xuancheng, Huang, Haijun, Chu, Quan, Liu, Pengzhi, Yan, Mumu, Wu

المصدر: 2022 IEEE 5th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2022 IEEE 5th International. :1058-1062 May, 2022

Relation: 2022 IEEE 5th International Electrical and Energy Conference (CIEEC)

المؤلفون: Tao, Huang^Aff38, Zhicheng, Lei^Aff38, Xuancheng, Huang^Aff38, Xuwei, Zhou^Aff39

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Chakraborty, Samarjit, Series Editor^Aff3, Chen, Jiming, Series Editor^Aff4, Chen, Shanben, Series Editor^Aff5, Chen, Tan Kay, Series Editor^Aff6, Dillmann, Rüdiger, Series Editor^Aff7, Duan, Haibin, Series Editor^Aff8, Ferrari, Gianluigi, Series Editor^Aff9, Ferre, Manuel, Series Editor^Aff10, Jabbari, Faryar, Series Editor^Aff11, Jia, Limin, Series Editor^Aff12, Kacprzyk, Janusz, Series Editor^Aff13, Khamis, Alaa, Series Editor^Aff14, Kroeger, Torsten, Series Editor^Aff15, Li, Yong, Series Editor^Aff16, Liang, Qilian, Series Editor^Aff17, Martín, Ferran, Series Editor^Aff18, Ming, Tan Cher, Series Editor^Aff19, Minker, Wolfgang, Series Editor^Aff20, Misra, Pradeep, Series Editor^Aff21, Mukhopadhyay, Subhas, Series Editor^Aff22, Ning, Cun-Zheng, Series Editor^Aff23, Nishida, Toyoaki, Series Editor^Aff24, Oneto, Luca, Series Editor^Aff25, Panigrahi, Bijaya Ketan, Series Editor^Aff26, Pascucci, Federica, Series Editor^Aff27, Qin, Yong, Series Editor^Aff28, Seng, Gan Woon, Series Editor^Aff29, Speidel, Joachim, Series Editor^Aff30, Veiga, Germano, Series Editor^Aff31, Wu, Haitao, Series Editor^Aff32, Zamboni, Walter, Series Editor^Aff33, Zhang, Junjie James, Series Editor^Aff34, Tan, Kay Chen, Series Editor^Aff35, Dong, Xuzhu, editor^Aff36, Cai, Li, editor^Aff37

المصدر: The Proceedings of 2023 4th International Symposium on Insulation and Discharge Computation for Power Equipment (IDCOMPU2023) : Volume I. 1100:593-602

المؤلفون: Zhicheng, Lei^Aff41, Mumu, Wu^Aff41, Xuancheng, Huang^Aff41, Yongjun, Xu^Aff42, Hongliang, Zhang^Aff42, Hongmiao, Yu^Aff42, Yan, Yan^Aff42, Zhiyu, Yan^Aff42

المساهمون: Angrisani, Leopoldo, Series Editor^Aff1, Arteaga, Marco, Series Editor^Aff2, Panigrahi, Bijaya Ketan, Series Editor^Aff3, Chakraborty, Samarjit, Series Editor^Aff4, Chen, Jiming, Series Editor^Aff5, Chen, Shanben, Series Editor^Aff6, Chen, Tan Kay, Series Editor^Aff7, Dillmann, Rüdiger, Series Editor^Aff8, Duan, Haibin, Series Editor^Aff9, Ferrari, Gianluigi, Series Editor^Aff10, Ferre, Manuel, Series Editor^Aff11, Hirche, Sandra, Series Editor^Aff12, Jabbari, Faryar, Series Editor^Aff13, Jia, Limin, Series Editor^Aff14, Kacprzyk, Janusz, Series Editor^Aff15, Khamis, Alaa, Series Editor^Aff16, Kroeger, Torsten, Series Editor^Aff17, Li, Yong, Series Editor^Aff18, Liang, Qilian, Series Editor^Aff19, Martín, Ferran, Series Editor^Aff20, Ming, Tan Cher, Series Editor^Aff21, Minker, Wolfgang, Series Editor^Aff22, Misra, Pradeep, Series Editor^Aff23, Möller, Sebastian, Series Editor^Aff24, Mukhopadhyay, Subhas, Series Editor^Aff25, Ning, Cun-Zheng, Series Editor^Aff26, Nishida, Toyoaki, Series Editor^Aff27, Oneto, Luca, Series Editor^Aff28, Pascucci, Federica, Series Editor^Aff29, Qin, Yong, Series Editor^Aff30, Seng, Gan Woon, Series Editor^Aff31, Speidel, Joachim, Series Editor^Aff32, Veiga, Germano, Series Editor^Aff33, Wu, Haitao, Series Editor^Aff34, Zamboni, Walter, Series Editor^Aff35, Zhang, Junjie James, Series Editor^Aff36, He, Jinghan, editor^Aff37, Li, Yaohua, editor^Aff38, Yang, Qingxin, editor^Aff39, Liang, Xidong, editor^Aff40

المصدر: The proceedings of the 16th Annual Conference of China Electrotechnical Society : Volume III. 891:1347-1358

المؤلفون: Fuping Zeng, Bingquan Xie, Dazhi Su, Chen Li, Zhicheng Lei, Guoming Ma, Liangjun Dai, Long Li, Ju Tang

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation. 29:866-873

مصطلحات موضوعية: Electrical and Electronic Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c1e216c485da6729cad5f3d716788b00
https://doi.org/10.1109/tdei.2022.3168334

المؤلفون: Zhicheng Lei

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::99d2deec88e5f2ed0a2ea1d4c4de920a

المؤلفون: Zhicheng Lei

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::448b397570e190c45d17d9a557a90c02
https://doi.org/10.2139/ssrn.4423608

المؤلفون: Liangjun Dai, Haotian Li, Zhicheng Lei, Qiang Yao, Kexin Zhu, Fuping Zeng

المصدر: 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE).

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::2a97a251dc6f4652a51fbc2fe411b971
https://doi.org/10.1109/ichve53725.2022.10014445