يعرض 1 - 10 نتائج من 28 نتيجة بحث عن '"Zhou, Jiye"', وقت الاستعلام: 0.95s تنقيح النتائج
  1. 1
    مؤتمر
    Monitoring Method and Application of Icing Thickness and Icing Type of Distribution Network Overhead Line Based on A Hydrophobic Marker and Image Defogging

    المؤلفون: He, Xingping, Yang, Jingsi, Zeng, Hanye, Li, Qingdong, Liu, Chengcheng, Zhou, Jiye

    المصدر: 2024 IEEE 2nd International Conference on Power Science and Technology (ICPST) Power Science and Technology (ICPST), 2024 IEEE 2nd International Conference on. :731-736 May, 2024

    Relation: 2024 IEEE 2nd International Conference on Power Science and Technology (ICPST)

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  2. 2
    مؤتمر
    Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

    المؤلفون: Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nogita, Kazuhiro

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :81-82 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  3. 3
    مؤتمر
    Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

    المؤلفون: Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Nogita, Kazuhiro

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :207-208 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  4. 4
    دورية أكاديمية
    The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

    المؤلفون: Tan, Xin F.Aff1, Aff2, IDs11664023108491_cor1, Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, KeithAff1, Aff3, Nogita, Kazuhiro

    المصدر: Journal of Electronic Materials. 53(3):1183-1191

    Find this article in full text from Springer Verlag. Full Text Finder
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  5. 5
    مؤتمر
    Evolution of the Sn-Bi Solder Microstructure vs. Temperature – an In- situ Scanning Electron Microscopy Study

    المؤلفون: Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko, Nogita, Kazuhiro

    المصدر: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :203-204 Apr, 2023

    Relation: 2023 International Conference on Electronics Packaging (ICEP)

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  6. 6
    مؤتمر
    Investigation of the Effects of Surface Finish and Reflow Conditions on the Microstructure and Mechanical Properties of Sn-based Solders

    المؤلفون: Somidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye, Nogita, Kazuhiro

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :177-178 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  7. 7
    دورية أكاديمية
    The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys

    المؤلفون: Zhou, Jiye, Tan, Xin FuAff1, Aff2, IDs1183702305870y_cor2, Gu, Qinfen, McDonald, Stuart D., Nogita, Kazuhiro

    المصدر: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 75(8):3149-3161

    Find this article in full text from Springer Verlag. Find this article in full text from ProQuest Full Text Finder
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  8. 8
    دورية أكاديمية
    In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

    المؤلفون: Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J., Nogita, Kazuhiro

    المصدر: In Materialia March 2024 33

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  9. 9
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

    View this record from ISI Web of Science
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  10. 10
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

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